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參數(shù)資料
型號(hào)： MC9RS08KB2CSC
廠商： Freescale Semiconductor
文件頁(yè)數(shù)： 36/37頁(yè)
文件大?。?/td> 0K
描述： MCU 8-BIT 2K FLASH 8-SOIC
標(biāo)準(zhǔn)包裝： 98
系列： RS08
核心處理器： RS08
芯體尺寸： 8-位
速度： 20MHz
連通性： I²C，SPI
外圍設(shè)備： LVD，POR，PWM，WDT
輸入/輸出數(shù)： 6
程序存儲(chǔ)器容量： 2KB（2K x 8）
程序存儲(chǔ)器類(lèi)型： 閃存
RAM 容量： 126 x 8
電壓 - 電源 (Vcc/Vdd)： 1.8 V ~ 5.5 V
數(shù)據(jù)轉(zhuǎn)換器： A/D 4x10b
振蕩器型： 內(nèi)部
工作溫度： -40°C ~ 85°C
封裝/外殼： 8-SOIC（0.154"，3.90mm 寬）
包裝： 管件
MC9RS08KB12 Series MCU Data Sheet, Rev. 5
Electrical Characteristics
Freescale Semiconductor
8
unusually high pin current (heavy loads), the difference between pin voltage and VSS or VDD will be very
small.
The average chip-junction temperature (TJ) in
°C can be obtained from:
TJ = TA + (PD × θJA)
Eqn. 1
where:
TA = Ambient temperature, °C
θJA = Package thermal resistance, junction-to-ambient, °C /W
PD = Pint + PI/O
Pint = IDD × VDD, Watts chip internal power
PI/O = Power dissipation on input and output pins user determined
For most applications, PI/O << Pint and can be neglected. An approximate relationship between PD and TJ
(if PI/O is neglected) is:
PD = K ÷ (TJ + 273°C)
Eqn. 2
Solving Equation 1 and Equation 2 for K gives:
K = PD × (TA + 273°C) + θJA× (PD)
2
Eqn. 3
where K is a constant pertaining to the particular part. K can be determined from Equation 3 by measuring
PD (at equilibrium) for a known TA. Using this value of K, the values of PD and TJ can be obtained by
solving Equation 1 and Equation 2 iteratively for any value of TA.
3.5
ESD Protection and Latch-Up Immunity
Although damage from electrostatic discharge (ESD) is much less common on these devices than on early
CMOS circuits, normal handling precautions must be used to avoid exposure to static discharge.
Qualification tests are performed to ensure that these devices can withstand exposure to reasonable levels
of static without suffering any permanent damage.
Table 4. Thermal Characteristics
Rating
Symbol
Value
Unit
Operating temperature range (packaged)
TA
TL to TH
–40 to 85
°C
Maximum junction temperature
TJMAX
150
°C
Thermal resistance 24-pin QFN
θ
JA
113
°C/W
Thermal resistance 20-pin SOIC
θ
JA
83
°C/W
Thermal resistance 16-pin SOIC NB
θ
JA
103
°C/W
Thermal resistance 16-pin TSSOP
θ
JA
29
°C/W
Thermal resistance 8-pin SOIC
θ
JA
150
°C/W
Thermal resistance 8-pin DFN
θ
JA
110
°C/W
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