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參數(shù)資料
| 型號(hào)： | MC74HC4067ADWG |
| 廠商： | ON Semiconductor |
| 文件頁數(shù)： | 4/12頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC MUX/DEMUX/QUAD SWITCH 24SOIC |
| 標(biāo)準(zhǔn)包裝： | 30 |
| 功能： | 多路復(fù)用器/多路分解器 |
| 電路： | 1 x 4:1 |
| 導(dǎo)通狀態(tài)電阻： | 140 歐姆 |
| 電壓電源： | 單電源 |
| 電壓 - 電源，單路/雙路(±)： | 2 V ~ 6 V |
| 電流 - 電源： | 4µA |
| 工作溫度： | -55°C ~ 125°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 24-SOIC（0.295"，7.50mm 寬） |
| 供應(yīng)商設(shè)備封裝： | 24-SOIC |
| 包裝： | 管件 |
MC74HC4067A
http://onsemi.com
12
PACKAGE DIMENSIONS
TSSOP24 7.8x4.4, 0.65P
CASE 948H
ISSUE B
DIM
D
MIN
MAX
7.90
MILLIMETERS
E1
4.30
4.50
A
1.20
A1
0.05
0.15
L
0.50
0.75
e
0.65 BSC
c
0.09
0.20
b
0.19
0.30
L2
0.25 BSC
M
0
8
__
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M,
1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b DOES NOT INCLUDE DAMBAR PROTRUSION.
DAMBAR PROTRUSION SHALL BE 0.08 MAX AT MMC. DAMBAR
CANNOT BE LOCATED ON THE LOWER RADIUS OF THE FOOT.
4. DIMENSION D DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS OR GATE BURRS. MOLD FLASH,
PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.15
PER SIDE. DIMENSION D IS DETERMINED AT DATUM PLANE H.
5. DIMENSION E1 DOES NOT INCLUDE INTERLEAD FLASH OR
PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL
NOT EXCEED 0.25 PER SIDE. DIMENSION E1 IS DETERMINED
AT DATUM PLANE H.
6. DATUMS A AND B ARE DETERMINED AT DATUM PLANE H.
7. A1 IS DEFINED AS THE VERTICAL DISTANCE FROM THE
SEATING PLANE TO THE LOWEST POINT ON THE PACKAGE
BODY.
7.70
---
24X
1.15
24X
0.42
0.65
DIMENSIONS: MILLIMETERS
PITCH
SOLDERING FOOTPRINT
E
6.40 BSC
6.70
RECOMMENDED
L
L2
GAUGE
DETAIL A
PLANE
C
DETAIL A
M
END VIEW
c
H
0.10
SEATING
PLANE
SIDE VIEW
A
C
0.05 C
C
24X
A1
PIN 1
REFERENCE
D
E1
24X
b
e
B
M
0.10
A
C
TOP VIEW
B
0.15 C
112
13
24
A
B
NOTE 3
2X 12 TIPS
E
NOTE 6
NOTE 4
NOTE 5
S
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MC74HC4067A/D
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