參數(shù)資料
型號: MC7457VG1000NC
廠商: Freescale Semiconductor
文件頁數(shù): 7/71頁
文件大?。?/td> 0K
描述: IC MPU RISC 1000MHZ 483FCCBGA
標(biāo)準(zhǔn)包裝: 36
系列: MPC74xx
處理器類型: 32-位 MPC74xx PowerPC
速度: 1.0GHz
電壓: 1.1V
安裝類型: 表面貼裝
封裝/外殼: 483-BCBGA,F(xiàn)CCBGA
供應(yīng)商設(shè)備封裝: 483-FCCBGA(29x29)
包裝: 托盤
Electrical and Thermal Characteristics
MPC7457 RISC Microprocessor Hardware Specifications, Rev. 8
Freescale Semiconductor
15
Table 6 provides the DC electrical characteristics for the MPC7457.
Coefficient of thermal expansion
6.8
ppm/°C
Notes:
1. Refer to Section 9.8, “Thermal Management Information,for more details about thermal management.
2. Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, airflow, power dissipation of other components on the board, and board thermal
resistance.
3. Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board horizontal.
4. Per JEDEC JESD51-6 with the board horizontal.
5. Thermal resistance between the die and the printed-circuit board per JEDEC JESD51-8. Board temperature is measured on
the top surface of the board near the package.
6. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method
1012.1) with the calculated case temperature. The actual value of RθJC for the part is less than 0.1°C/W.
Table 6. DC Electrical Specifications
At recommended operating conditions. See Table 4.
Characteristic
Nominal
Bus
Voltage 1
Symbol
Min
Max
Unit
Notes
Input high voltage
(all inputs including SYSCLK)
1.5
VIH
GVDD × 0.65
GVDD + 0.3
V
2
1.8
OVDD/GVDD × 0.65
OVDD/GVDD + 0.3
V
2.5
1.7
OVDD/GVDD + 0.3
V
Input low voltage
(all inputs including SYSCLK)
1.5
VIL
–0.3
GVDD × 0.35
V
2, 6
1.8
–0.3
OVDD/GVDD × 0.35
V
2.5
–0.3
0.7
V
Input leakage current, Vin = GVDD/OVDD
—Iin
—30
A
2, 3
High-impedance (off-state) leakage
current, Vin = GVDD/OVDD
—ITSI
30
A
2, 3, 4
Output high voltage, IOH = –5 mA
1.5
VOH
OVDD/GVDD – 0.45
V
6
1.8
OVDD/GVDD – 0.45
V
2.5
1.8
V
Output low voltage, IOL = 5 mA
1.5
VOL
—0.45
V
6
1.8
0.45
V
2.5
0.6
V
Table 5. Package Thermal Characteristics 1
(continued)
Characteristic
Symbol
Value
Unit
Notes
MPC7447
MPC7457
相關(guān)PDF資料
PDF描述
ABB105DHAR CONN EDGECARD 210PS R/A .050 SLD
KMC8610VT1333JB IC HOST PROCESS 1333MHZ 783-PBGA
ACB105DHAR CONN EDGECARD 210PS R/A .050 DIP
FMC28DREN-S734 CONN EDGECARD 56POS .100 EYELET
XC4025E-2HQ304C IC FPGA C-TEMP 5V 2SPD 304-HQFP
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MC7457VG1267LC 功能描述:微處理器 - MPU APOLO7 RV1.2 1.3V 105C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MC7457VG733NC 功能描述:IC MPU RISC 733MHZ 483FCCBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - 微處理器 系列:MPC74xx 標(biāo)準(zhǔn)包裝:1 系列:MPC85xx 處理器類型:32-位 MPC85xx PowerQUICC III 特點:- 速度:1.2GHz 電壓:1.1V 安裝類型:表面貼裝 封裝/外殼:783-BBGA,F(xiàn)CBGA 供應(yīng)商設(shè)備封裝:783-FCPBGA(29x29) 包裝:托盤
MC7457VG867NC 功能描述:微處理器 - MPU APOLO7 RV1.2 1.1V 105C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MC74A5-33SNTR 制造商:Rochester Electronics LLC 功能描述:- Tape and Reel
MC74A5-50T 制造商:Rochester Electronics LLC 功能描述:- Tape and Reel