參數(shù)資料
型號: MC7457RX1267LC
廠商: Freescale Semiconductor
文件頁數(shù): 62/71頁
文件大小: 0K
描述: IC MPU RISC 32BIT 483FCCBGA
標準包裝: 36
系列: MPC74xx
處理器類型: 32-位 MPC74xx PowerPC
速度: 1.267GHz
電壓: 1.3V
安裝類型: 表面貼裝
封裝/外殼: 483-BCBGA,F(xiàn)CCBGA
供應商設備封裝: 483-FCCBGA(29x29)
包裝: 托盤
Part Numbering and Marking
MPC7457 RISC Microprocessor Hardware Specifications, Rev. 8
Freescale Semiconductor
65
Figure 30. Recommended Thermal Model of MPC7447 and MPC7457
10 Part Numbering and Marking
Ordering information for the parts fully covered by this specification document is provided in
correspond to a maximum processor core frequency. For available frequencies, contact your local
Freescale sales office. In addition to the processor frequency, the part numbering scheme also includes an
application modifier which may specify special application conditions. Each part number also contains a
revision level code which refers to the die mask revision number. Section 10.2, “Part Numbers Not Fully
Addressed by This Document,” lists the part numbers which do not fully conform to the specifications of
this document. These special part numbers require an additional document called a referred to as a
hardware specification addendum.
10.1
Part Numbers Fully Addressed by This Document
Table 22 provides the Freescale part numbering nomenclature for the MPC7457.
Bump and Underfill
Die
Substrate
Solder and Air
Die
Substrate
Side View of Model (Not to Scale)
Top View of Model (Not to Scale)
x
y
z
Conductivity
Value
Unit
Bump and Underfill
kx
0.6
W/(m K)
ky
0.6
kz
2
Substrate
k18
Solder Ball and Air
kx
0.034
ky
0.034
kz
3.8
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