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參數(shù)資料
| 型號： | MC7447AHX1167NB |
| 廠商： | Freescale Semiconductor |
| 文件頁數(shù)： | 38/56頁 |
| 文件大小： | 0K |
| 描述： | IC MPU RISC 1167MHZ 360-FCCBGA |
| 標(biāo)準(zhǔn)包裝： | 44 |
| 系列： | MPC74xx |
| 處理器類型： | 32-位 MPC74xx PowerPC |
| 速度： | 1.167GHZ |
| 電壓： | 1.1V |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 360-BCBGA，F(xiàn)CCBGA |
| 供應(yīng)商設(shè)備封裝： | 360-FCCBGA（25x25） |
| 包裝： | 托盤 |
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MPC7447A RISC Microprocessor Hardware Specifications, Rev. 5
Freescale Semiconductor
43
System Design Information
9.8
Thermal Management Information
This section provides thermal management information for the high coefficient of thermal expansion
(HCTE) package for air-cooled applications. Proper thermal control design is primarily dependent on the
system-level design—the heat sink, airflow, and thermal interface material. The MPC7447A implements
several features designed to assist with thermal management, including DFS and the temperature diode.
DFS reduces the power consumption of the device by reducing the core frequency; see Section 9.8.5.1,
“Power Consumption with DFS Enabled,” for specific information regarding power reduction and DFS.
The temperature diode allows an external device to monitor the die temperature in order to detect excessive
temperature conditions and alert the system; see Section 9.8.4, “Temperature Diode,” for more
information.
To reduce the die-junction temperature, heat sinks may be attached to the package by several
methods—spring clip to holes in the printed-circuit board or package, and mounting clip and screw
assembly (see Figure 20 and Figure 21); however, due to the potential large mass of the heat sink,
attachment through the printed-circuit board is suggested. In any implementation of a heat sink solution,
the force on the die should not exceed ten pounds.
Figure 20. BGA Package Exploded Cross-Sectional View with Several Heat Sink Options
NOTE
A clip on heat sink is not recommended for LGA because there may not be
adequate clearance between the device and the circuit board. A through-hole
solution is recommended, as shown in Figure 21 below.
Thermal
Heat Sink
HCTE BGA Package
Heat Sink
Clip
Printed-Circuit Board
Interface Material
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MC7447AHX1167NB | 制造商:Freescale Semiconductor 功能描述:IC 32-BIT MPU 1.167GHZ 360-FCCBGA |
| MC7447AHX1250PC | 制造商:Freescale Semiconductor 功能描述:MPU MPC74XX RISC 32BIT 0.13UM 1.25GHZ 1.8V/2.5V 360FCCBGA - Bulk |
| MC7447AHX1267LB | 功能描述:微處理器 - MPU APOLO7PM RV1.1 1.3V 105C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MC7447AHX1333LB | 制造商:Freescale Semiconductor 功能描述:MPU MPC74XX RISC 32BIT 0.13UM 1.333GHZ 1.8V/2.5V 360FCCBGA - Trays |
| MC7447AHX1420LB | 功能描述:微處理器 - MPU APOLO7PM RV1.1 1.3V 105C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
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