
Mechanical Specifications
28-Pin Small Outline Integrated Circuit (SOIC)
MC68HC908JB8MC68HC08JB8MC68HC08JT8 — Rev. 2.1
Technical Data
MOTOROLA
Mechanical Specifications
265
19.4 28-Pin Small Outline Integrated Circuit (SOIC)
Figure 19-2. 28-Pin SOIC (Case 751F)
19.5 20-Pin Dual In-Line Package (PDIP)
Figure 19-3. 20-Pin PDIP (Case 738)
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.13
(0.005) TOTAL IN EXCESS OF D DIMENSION
AT MAXIMUM MATERIAL CONDITION.
J
K
F
1
15
14
28
-A-
-B-
28X
14X
D
P
S
A
M
0.010 (0.25)
B S
T
M
0.010 (0.25)
B M
26X
G
-T-
SEATING
PLANE
C
X 45
R
M
DIM
MIN
MAX
MIN
MAX
INCHES
MILLIMETERS
A
17.80
18.05
0.701
0.711
B
7.40
7.60
0.292
0.299
C
2.35
2.65
0.093
0.104
D
0.35
0.49
0.014
0.019
F
0.41
0.90
0.016
0.035
G
1.27 BSC
0.050 BSC
J
0.23
0.32
0.009
0.013
K
0.13
0.29
0.005
0.011
M
P
10.01
10.55
0.395
0.415
R
0.25
0.75
0.010
0.029
0
°
0
°
8
°
8
°
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
M
L
J 20 PL
M
B
M
0.25 (0.010)
T
DIM
MIN
MAX
MIN
MAX
MILLIMETERS
INCHES
A
25.66
27.17
1.010
1.070
B
6.10
6.60
0.240
0.260
C
3.81
4.57
0.150
0.180
D
0.39
0.55
0.015
0.022
G
2.54 BSC
0.100 BSC
J
0.21
0.38
0.008
0.015
K
2.80
3.55
0.110
0.140
L
7.62 BSC
0.300 BSC
M
0
15
0
15
N
0.51
1.01
0.020
0.040
__
E
1.27
1.77
0.050
0.070
1
11
10
20
–A–
SEATING
PLANE
K
N
F
G
D 20 PL
–T–
M
A
M
0.25 (0.010)
T
E
B
C
F
1.27 BSC
0.050 BSC