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56F8367 Technical Data, Rev. 3.0
4
Freescale Semiconductor
Preliminary
Part 1: Overview . . . . . . . . . . . . . . . . . . . . . . .5
1.1. 56F8367/56F8167 Features . . . . . . . . . . . . . 5
1.2. Device Description . . . . . . . . . . . . . . . . . . . . 7
1.3. Award-Winning Development Environment . 9
1.4. Architecture Block Diagram. . . . . . . . . . . . . 10
1.5. Product Documentation. . . . . . . . . . . . . . . . 14
1.6. Data Sheet Conventions . . . . . . . . . . . . . . . 14
Part 2: Signal/Connection Descriptions . . .15
2.1. Introduction . . . . . . . . . . . . . . . . . . . . . . . . . 15
2.2. Signal Pins . . . . . . . . . . . . . . . . . . . . . . . . . 18
Part 3: On-Chip Clock Synthesis (OCCS) . .38
3.1. Introduction . . . . . . . . . . . . . . . . . . . . . . . . . 38
3.2. External Clock Operation . . . . . . . . . . . . . . 38
3.3. Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
Part 4: Memory Operating Modes (MEM) . .40
4.1. Introduction . . . . . . . . . . . . . . . . . . . . . . . . . 40
4.2. Program Map. . . . . . . . . . . . . . . . . . . . . . . . 41
4.3. Interrupt Vector Table . . . . . . . . . . . . . . . . . 42
4.4. Data Map . . . . . . . . . . . . . . . . . . . . . . . . . . 46
4.5. Flash Memory Map . . . . . . . . . . . . . . . . . . . 46
4.6. EOnCE Memory Map . . . . . . . . . . . . . . . . . 48
4.7. Peripheral Memory Mapped Registers . . . . 49
4.8. Factory Programmed Memory . . . . . . . . . . 79
Part 5: Interrupt Controller (ITCN) . . . . . . . .80
5.1. Introduction . . . . . . . . . . . . . . . . . . . . . . . . . 80
5.2. Features . . . . . . . . . . . . . . . . . . . . . . . . . . . 80
5.3. Functional Description. . . . . . . . . . . . . . . . . 80
5.4. Block Diagram . . . . . . . . . . . . . . . . . . . . . . 82
5.5. Operating Modes . . . . . . . . . . . . . . . . . . . . 82
5.6. Register Descriptions . . . . . . . . . . . . . . . . . 83
5.7. Resets . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108
Part 6: System Integration Module (SIM) .110
6.1. Overview . . . . . . . . . . . . . . . . . . . . . . . . . 110
6.2. Features . . . . . . . . . . . . . . . . . . . . . . . . . . 110
6.3. Operating Modes . . . . . . . . . . . . . . . . . . . 111
6.4. Operating Mode Register . . . . . . . . . . . . . 111
6.5. Register Descriptions . . . . . . . . . . . . . . . . 112
6.6. Clock Generation Overview. . . . . . . . . . . . 126
6.7. Power Down Modes Overview . . . . . . . . . 127
6.8. Stop and Wait Mode Disable Function . . . 128
6.9. Resets . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128
Part 7: Security Features . . . . . . . . . . . . . .129
7.1. Operation with Security Enabled. . . . . . . . 129
7.2. Flash Access Blocking Mechanisms . . . . . 129
Part 8: General Purpose Input/Output
(GPIO) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 132
8.1. Introduction. . . . . . . . . . . . . . . . . . . . . . . . 132
8.2. Memory Maps . . . . . . . . . . . . . . . . . . . . . .132
8.3. Configuration. . . . . . . . . . . . . . . . . . . . . . . 132
Part 9: Joint Test Action Group (JTAG) . 137
9.1. 56F8367 Information . . . . . . . . . . . . . . . . .137
Part 10: Specifications . . . . . . . . . . . . . . . 137
10.1. General Characteristics . . . . . . . . . . . . . .137
10.2. DC Electrical Characteristics . . . . . . . . . .141
10.3. AC Electrical Characteristics . . . . . . . . . .145
10.4. Flash Memory Characteristics . . . . . . . . .145
10.5. External Clock Operation Timing . . . . . . 146
10.6. Phase Locked Loop Timing . . . . . . . . . . .146
10.7. Crystal Oscillator Timing . . . . . . . . . . . . . 147
10.8. External Memory Interface Timing . . . . . .147
10.9. Reset, Stop, Wait, Mode Select, and Interrupt
Timing . . . . . . . . . . . . . . . . . . . . .150
10.10. Serial Peripheral Interface (SPI) Timing .152
10.11. Quad Timer Timing . . . . . . . . . . . . . . . .156
10.12. Quadrature Decoder Timing . . . . . . . . . .156
10.13. Serial Communication Interface
(SCI) Timing . . . . . . . . . . . . . . . .157
10.14. Controller Area Network (CAN) Timing .158
10.15. JTAG Timing . . . . . . . . . . . . . . . . . . . . . 158
10.16. Analog-to-Digital Converter
(ADC) Parameters . . . . . . . . . . . .160
10.17. Equivalent Circuit for ADC Inputs . . . . . .163
10.18. Power Consumption . . . . . . . . . . . . . . . 163
Part 11: Packaging. . . . . . . . . . . . . . . . . . . 165
11.1. 56F8367 Package and Pin-Out Information 165
11.2. 56F8167 Package and Pin-Out Information 172
Part 12: Design Considerations . . . . . . . . 176
12.1. Thermal Design Considerations . . . . . . . .176
12.2. Electrical Design Considerations . . . . . . .177
12.3. Power Distribution and I/O Ring
12.4. Implementation . . . . . . . . . . . . . . . . . . . . .178
Part 13: Ordering Information . . . . . . . . . 179
Table of Contents