MC33567
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12
PACKAGE DIMENSIONS
SO8
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 75107
ISSUE AA
SEATING
PLANE
1
4
5
8
N
J
X 45
_
K
NOTES:
1.  DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2.  CONTROLLING DIMENSION: MILLIMETER.
3.  DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4.  MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER
SIDE.
5.  DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN
EXCESS OF THE D DIMENSION AT MAXIMUM
MATERIAL CONDITION.
6.  75101 THRU 75106 ARE OBSOLETE. NEW
STANDAARD IS 75107
A
B
S
D
H
C
0.10 (0.004)
DIM
A
MIN
MAX
MIN
MAX
INCHES
4.80
5.00
0.189
0.197
MILLIMETERS
B
3.80
4.00
0.150
0.157
C
1.35
1.75
0.053
0.069
D
0.33
0.51
0.013
0.020
G
1.27 BSC
0.050 BSC
H
0.10
0.25
0.004
0.010
J
0.19
0.25
0.007
0.010
K
0.40
1.27
0.016
0.050
M
0
8
0
8
N
0.25
0.50
0.010
0.020
S
5.80
6.20
0.228
0.244
X
Y
G
M
Y
M
0.25 (0.010)
Z
Y
M
0.25 (0.010)
Z
S
X
S
M
_
_
_
_
Figure 23. SO8
1.52
0.060
7.0
0.275
0.6
0.024
1.270
0.050
4.0
0.155
mm
inches
SCALE 6:1
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
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