參數(shù)資料
型號: MC14174BDR2G
廠商: ON Semiconductor
文件頁數(shù): 1/6頁
文件大?。?/td> 0K
描述: IC FLIP FLOP HEX TYPE D 16-SOIC
標準包裝: 1
系列: 4000B
功能: 復位
類型: D 型總線
輸出類型: 非反相
元件數(shù): 1
每個元件的位元數(shù): 6
頻率 - 時鐘: 15.5MHz
延遲時間 - 傳輸: 65ns
觸發(fā)器類型: 正邊沿
輸出電流高,低: 8.8mA,8.8mA
電源電壓: 3 V ~ 18 V
工作溫度: -55°C ~ 125°C
安裝類型: 表面貼裝
封裝/外殼: 16-SOIC(0.154",3.90mm 寬)
包裝: 剪切帶 (CT)
其它名稱: MC14174BDR2GOSCT
Semiconductor Components Industries, LLC, 2013
May, 2013 Rev. 8
1
Publication Order Number:
MC14174B/D
MC14174B
Hex Type D Flip-Flop
The MC14174B hex type D flipflop is constructed with MOS
Pchannel and Nchannel enhancement mode devices in a single
monolithic structure. Data on the D inputs which meets the setup time
requirements is transferred to the Q outputs on the positive edge of the
clock pulse. All six flipflops share common clock and reset inputs.
The reset is active low, and independent of the clock.
Features
Static Operation
All Inputs and Outputs Buffered
Diode Protection on All Inputs
Supply Voltage Range = 3.0 Vdc to 18 Vdc
Capable of Driving Two LowPower TTL Loads or One LowPower
Schottky TTL Load Over the Rated Temperature Range
Functional Equivalent to TTL 74174
These Devices are PbFree and are RoHS Compliant
NLV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AECQ100
Qualified and PPAP Capable
MAXIMUM RATINGS (Voltages Referenced to VSS)
Parameter
Symbol
Value
Unit
DC Supply Voltage Range
VDD
0.5 to +18.0
V
Input or Output Voltage Range
(DC or Transient)
Vin, Vout
0.5 to VDD
+ 0.5
V
Input or Output Current (DC or Transient)
per Pin
Iin, Iout
±10
mA
Power Dissipation, per Package (Note 1)
PD
500
mW
Ambient Temperature Range
TA
55 to +125
°C
Storage Temperature Range
65 to +150
°C
Lead Temperature (8Second Soldering)
260
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Temperature Derating: Plastic “P and D/DW”
Packages: – 7.0 mW/_C From 65_C To 125_C
This device contains protection circuitry to guard against damage due to high
static voltages or electric fields. However, precautions must be taken to avoid
applications of any voltage higher than maximum rated voltages to this
highimpedance circuit. For proper operation, Vin and Vout should be constrained
to the range VSS v (Vin or Vout) v VDD.
Unused inputs must always be tied to an appropriate logic voltage level
(e.g., either VSS or VDD). Unused outputs must be left open.
Device
Package
Shipping
ORDERING INFORMATION
http://onsemi.com
NLV14174BDR2G SOIC16
(PbFree)
2500/Tape & Reel
MC14174BCPG
PDIP16
(PbFree)
500 Units/Rail
For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
A
= Assembly Location
WL
= Wafer Lot
YY, Y = Year
WW = Work Week
G
= PbFree Package
MARKING
DIAGRAMS
PDIP16
P SUFFIX
CASE 648
SOIC16
D SUFFIX
CASE 751B
1
16
14174BG
AWLYWW
16
1
MC14174BCP
AWLYYWWG
1
MC14174BDR2G
SOIC16
(PbFree)
2500/Tape & Reel
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