參數(shù)資料
型號: MC10EP446MNR4G
廠商: ON Semiconductor
文件頁數(shù): 11/20頁
文件大?。?/td> 0K
描述: IC CONV PAR/SER 8BIT DIFF 32-QFN
標(biāo)準(zhǔn)包裝: 1,000
接口: 差分
電源電壓: 3 V ~ 5.5 V
封裝/外殼: 32-VFQFN 裸露焊盤
供應(yīng)商設(shè)備封裝: 32-QFN(5x5)
包裝: 帶卷 (TR)
安裝類型: 表面貼裝
MC10EP446, MC100EP446
http://onsemi.com
19
PACKAGE DIMENSIONS
DETAIL Y
A
S1
V
B
1
8
9
17
25
32
AE
P
DETAIL Y
BASE
N
J
D
F
METAL
SECTION AEAE
G
SEATING
PLANE
R
Q
_
W
K
X
0.250
(0.010)
GAUGE
PLANE
E
C
H
DETAIL AD
A1
B1
V1
4X
S
4X
9
T
Z
U
T-U
0.20 (0.008)
Z
AC
T-U
0.20 (0.008)
Z
AB
0.10 (0.004) AC
AC
AB
M
_
8X
T
,
U
,
Z
T-U
M
0.20
(0.008)
Z
AC
32 LEAD LQFP
CASE 873A02
ISSUE C
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION:
MILLIMETER.
3. DATUM PLANE AB IS LOCATED AT
BOTTOM OF LEAD AND IS COINCIDENT
WITH THE LEAD WHERE THE LEAD
EXITS THE PLASTIC BODY AT THE
BOTTOM OF THE PARTING LINE.
4. DATUMS T, U, AND Z TO BE
DETERMINED AT DATUM PLANE AB.
5. DIMENSIONS S AND V TO BE
DETERMINED AT SEATING PLANE AC.
6. DIMENSIONS A AND B DO NOT
INCLUDE MOLD PROTRUSION.
ALLOWABLE PROTRUSION IS 0.250
(0.010) PER SIDE. DIMENSIONS A AND
B DO INCLUDE MOLD MISMATCH AND
ARE DETERMINED AT DATUM PLANE
AB.
7. DIMENSION D DOES NOT INCLUDE
DAMBAR PROTRUSION. DAMBAR
PROTRUSION SHALL NOT CAUSE THE
D DIMENSION TO EXCEED 0.520 (0.020).
8. MINIMUM SOLDER PLATE THICKNESS
SHALL BE 0.0076 (0.0003).
9. EXACT SHAPE OF EACH CORNER
MAY VARY FROM DEPICTION.
DIM
A
MIN
MAX
MIN
MAX
INCHES
7.000 BSC
0.276 BSC
MILLIMETERS
B
7.000 BSC
0.276 BSC
C
1.400
1.600
0.055
0.063
D
0.300
0.450
0.012
0.018
E
1.350
1.450
0.053
0.057
F
0.300
0.400
0.012
0.016
G
0.800 BSC
0.031 BSC
H
0.050
0.150
0.002
0.006
J
0.090
0.200
0.004
0.008
K
0.450
0.750
0.018
0.030
M
12 REF
N
0.090
0.160
0.004
0.006
P
0.400 BSC
0.016 BSC
Q
1
5
1
5
R
0.150
0.250
0.006
0.010
V
9.000 BSC
0.354 BSC
V1
4.500 BSC
0.177 BSC
__
_
B1
3.500 BSC
0.138 BSC
A1
3.500 BSC
0.138 BSC
S
9.000 BSC
0.354 BSC
S1
4.500 BSC
0.177 BSC
W
0.200 REF
0.008 REF
X
1.000 REF
0.039 REF
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