- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄45202 > MB9BF405NABGL 32-BIT, FLASH, 80 MHz, RISC MICROCONTROLLER, PBGA112 PDF資料下載
參數(shù)資料
| 型號： | MB9BF405NABGL |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, FLASH, 80 MHz, RISC MICROCONTROLLER, PBGA112 |
| 封裝： | 10 X 10 MM, 1.45 MM HEIGHT, 0.80 MM PITCH, PLASTIC, FBGA-112 |
| 文件頁數(shù)： | 39/100頁 |
| 文件大?。?/td> | 955K |
| 代理商： | MB9BF405NABGL |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁第32頁第33頁第34頁第35頁第36頁第37頁第38頁當(dāng)前第39頁第40頁第41頁第42頁第43頁第44頁第45頁第46頁第47頁第48頁第49頁第50頁第51頁第52頁第53頁第54頁第55頁第56頁第57頁第58頁第59頁第60頁第61頁第62頁第63頁第64頁第65頁第66頁第67頁第68頁第69頁第70頁第71頁第72頁第73頁第74頁第75頁第76頁第77頁第78頁第79頁第80頁第81頁第82頁第83頁第84頁第85頁第86頁第87頁第88頁第89頁第90頁第91頁第92頁第93頁第94頁第95頁第96頁第97頁第98頁第99頁第100頁
43
FUJITSU SEMICONDUCTOR CONFIDENTIAL
r3.0
MB9B400A Series
HANDLING PRECAUTIONS
Any semiconductor devices have inherently a certain rate of failure. The possibility of failure is greatly
affected by the conditions in which they are used (circuit conditions, environmental conditions, etc.). This
page describes precautions that must be observed to minimize the chance of failure and to obtain higher
reliability from your FUJITSU SEMICONDUCTOR semiconductor devices.
1. Precautions for Product Design
This section describes precautions when designing electronic equipment using semiconductor devices.
·
Absolute Maximum Ratings
Semiconductor devices can be permanently damaged by application of stress (voltage, current, temperature,
etc.) in excess of certain established limits, called absolute maximum ratings. Do not exceed these ratings.
·
Recommended Operating Conditions
Recommended operating conditions are normal operating ranges for the semiconductor device. All the
device's electrical characteristics are warranted when operated within these ranges.
Always use semiconductor devices within the recommended operating conditions. Operation outside these
ranges may adversely affect reliability and could result in device failure.
No warranty is made with respect to uses, operating conditions, or combinations not represented on the data
sheet. Users considering application outside the listed conditions are advised to contact their sales
representative beforehand.
·
Processing and Protection of Pins
These precautions must be followed when handling the pins which connect semiconductor devices to power
supply and input/output functions.
(1) Preventing Over-Voltage and Over-Current Conditions
Exposure to voltage or current levels in excess of maximum ratings at any pin is likely to cause
deterioration within the device, and in extreme cases leads to permanent damage of the device. Try to
prevent such overvoltage or over-current conditions at the design stage.
(2) Protection of Output Pins
Shorting of output pins to supply pins or other output pins, or connection to large capacitance can
cause large current flows. Such conditions if present for extended periods of time can damage the
device.
Therefore, avoid this type of connection.
(3) Handling of Unused Input Pins
Unconnected input pins with very high impedance levels can adversely affect stability of operation.
Such pins should be connected through an appropriate resistance to a power supply pin or ground pin.
·
Latch-up
Semiconductor devices are constructed by the formation of P-type and N-type areas on a substrate. When
subjected to abnormally high voltages, internal parasitic PNPN junctions (called thyristor structures) may
be formed, causing large current levels in excess of several hundred mA to flow continuously at the power
supply pin. This condition is called latch-up.
CAUTION: The occurrence of latch-up not only causes loss of reliability in the semiconductor device, but
can cause injury or damage from high heat, smoke or flame. To prevent this from happening, do the
following:
(1) Be sure that voltages applied to pins do not exceed the absolute maximum ratings. This should
include attention to abnormal noise, surge levels, etc.
(2) Be sure that abnormal current flows do not occur during the power-on sequence.
Code: DS00-00004-1Ea
DS706-00023-1v0-E
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| MB9BF404NAPMC | 32-BIT, FLASH, 80 MHz, RISC MICROCONTROLLER, PQFP100 |
| MB9BF406NAPMC | 32-BIT, FLASH, 80 MHz, RISC MICROCONTROLLER, PQFP100 |
| MB9BF406RAPMC | 32-BIT, FLASH, 80 MHz, RISC MICROCONTROLLER, PQFP120 |
| MB9BF404NABGL | 32-BIT, FLASH, 80 MHz, RISC MICROCONTROLLER, PBGA112 |
| MB9BF405NAPMC | 32-BIT, FLASH, 80 MHz, RISC MICROCONTROLLER, PQFP100 |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MB9BF414RPMC-GE1 | 制造商:FUJITSU 功能描述:32-bit Microcontrollers with 256K Flash |
| MB9BF466LPMC1-G-JNE2 | 功能描述:IC MCU 32BIT 544KB FLASH 64LQFP 制造商:cypress semiconductor corp 系列:FM4 MB9B460L 包裝:托盤 零件狀態(tài):在售 核心處理器:ARM? Cortex?-M4F 核心尺寸:32-位 速度:160MHz 連接性:CAN，CSIO，I2C，LIN，UART/USART 外設(shè):DMA，LVD，POR，PWM，WDT I/O 數(shù):48 程序存儲容量:544KB（544K x 8） 程序存儲器類型:閃存 EEPROM 容量:- RAM 容量:64K x 8 電壓 - 電源（Vcc/Vdd）:2.7 V ~ 5.5 V 數(shù)據(jù)轉(zhuǎn)換器:A/D 15x12b，A/D 2x10b 振蕩器類型:內(nèi)部 工作溫度:-40°C ~ 125°C（TA） 封裝/外殼:64-LQFP 供應(yīng)商器件封裝:64-LQFP（10x10） 標(biāo)準(zhǔn)包裝:160 |
| MB9BF500 | 制造商:FUJITSU 制造商全稱:Fujitsu Component Limited. 功能描述:32-bit MCUs with ARM Cortex-M3 Core |
| MB9BF504NBPMC-G-JNE2 | 制造商:FUJITSU 功能描述: |
| MB9BF504NPMC-G-JNE1 | 功能描述:IC MCU 32BIT 256KB FLASH 100LQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - 微控制器， 系列:FM3 MB9B500 產(chǎn)品培訓(xùn)模塊:MCU Product Line Introduction XMEGA Introduction AVR XMEGA USB Connectivity 標(biāo)準(zhǔn)包裝:90 系列:AVR® XMEGA 核心處理器:AVR 芯體尺寸:8/16-位 速度:32MHz 連通性:I²C，IrDA，SPI，UART/USART 外圍設(shè)備:欠壓檢測/復(fù)位，DMA，POR，PWM，WDT 輸入/輸出數(shù):50 程序存儲器容量:192KB（96K x 16） 程序存儲器類型:閃存 EEPROM 大小:4K x 8 RAM 容量:16K x 8 電壓 - 電源 (Vcc/Vdd):1.6 V ~ 3.6 V 數(shù)據(jù)轉(zhuǎn)換器:A/D 16x12b; D/A 2x12b 振蕩器型:內(nèi)部 工作溫度:-40°C ~ 85°C 封裝/外殼:64-TQFP 包裝:托盤 配用:ATSTK600-RC14-ND - STK600 SOCKET/ADAPTER 64TQFPATSTK600-TQFP64-ND - STK600 SOCKET/ADAPTER 64-TQFPATAVRONEKIT-ND - KIT AVR/AVR32 DEBUGGER/PROGRMMRATAVRISP2-ND - PROGRAMMER AVR IN SYSTEM |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。