參數(shù)資料
型號(hào): MB9BF306NAPMC
元件分類(lèi): 微控制器/微處理器
英文描述: 32-BIT, FLASH, 80 MHz, RISC MICROCONTROLLER, PQFP100
封裝: 14 X 14 MM, 1.70 MM HEIGHT, 0.50 MM PITCH, PLASTIC, LQFP-100
文件頁(yè)數(shù): 3/104頁(yè)
文件大小: 1005K
代理商: MB9BF306NAPMC
100
FUJITSU SEMICONDUCTOR CONFIDENTIAL
r3.0
MB9B300A Series
(Continued)
120-pin plastic LQFP
Lead pitch
0.50 mm
Package width
×
package length
16.0
× 16.0 mm
Lead shape
Gullwing
Sealing method
Plastic mold
Mounting height
1.70 mm MAX
Weight
0.88 g
Code
(Reference)
P-LFQFP120-16
×16-0.50
120-pin plastic LQFP
(FPT-120P-M21)
C
2002-2010 FUJITSU SEMICONDUCTOR LIMITED F120033S-c-4-7
1
30
60
31
90
61
120
91
SQ
18.00±0.20(.709±.008)SQ
0.50(.020)
0.22±0.05
(.009±.002)
M
0.08(.003)
INDEX
.006–.001
+.002
–0.03
+0.05
0.145
"A"
0.08(.003)
LEAD No.
.059 –.004
+.008
–0.10
+0.20
1.50
Details of "A" part
(Mounting height)
0.60±0.15
(.024±.006)
0.25(.010)
(.004±.002)
0.10±0.05
(Stand off)
0~8°
*
.630 –.004
+.016
–0.10
+0.40
16.00
Dimensions in mm (inches).
Note: The values in parentheses are reference values.
Note 1)
* : These dimensions do not include resin protrusion.
Resin protrusion is +0.25(.010) MAX(each side).
Note 2) Pins width and pins thickness include plating thickness.
Note 3) Pins width do not include tie bar cutting remainder.
Please check the latest package dimension at the following URL.
http://edevice.fujitsu.com/package/en-search/
DS706-00024-1v0-E
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