
MB91460D Series
DS07-16612-2E
21
■ HANDLING DEVICES
1.
Preventing Latch-up
Latch-up may occur in a CMOS IC if a voltage higher than (VDD5, VDD35 or HVDD5) or less than (VSS5 or HVSS5)
is applied to an input or output pin or if a voltage exceeding the rating is applied between the power supply pins
and ground pins. If latch-up occurs, the power supply current increases rapidly, sometimes resulting in thermal
breakdown of the device. Therefore, be very careful not to apply voltages in excess of the absolute maximum
ratings.
2.
Handling of unused input pins
If unused input pins are left open, abnormal operation may result. Any unused input pins should be connected
to pull-up or pull-down resistor (2K
Ω to 10KΩ) or enable internal pullup or pulldown resisters (PPER/PPCR)
before the input enable (PORTEN) is activated by software. The mode pins MD_x can be connected to VSS5 or
VDD5 directly. Unused ALARM input pins can be connected to AVSS5 directly.
3.
Power supply pins
In MB91460D series, devices including multiple power supply pins and ground pins are designed as follows;
pins necessary to be at the same potential are interconnected internally to prevent malfunctions such as latch-
up. All of the power supply pins and ground pins must be externally connected to the power supply and ground
respectively in order to reduce unnecessary radiation, to prevent strobe signal malfunctions due to the ground
level rising and to follow the total output current ratings. Furthermore, the power supply pins and ground pins of
the MB91460D series must be connected to the current supply source via a low impedance.
It is also recommended to connect a ceramic capacitor of approximately 0.1
μF as a bypass capacitor between
power supply pin and ground pin near this device.
This series has a built-in step-down regulator. Connect a bypass capacitor of 4.7
μF (use a X7R ceramic
capacitator) to VCC18C pin for the regulator.
4.
Crystal oscillator circuit
Noise in proximity to the X0 (X0A) and X1 (X1A) pins can cause the device to operate abnormally. Printed circuit
boards should be designed so that the X0 (X0A) and X1 (X1A) pins, and crystal oscillator, as well as bypass
capacitors connected to ground, are located near the device and ground.
It is recommended that the printed circuit board layout be designed such that the X0 and X1 pins or X0A and
X1A pins are surrounded by ground plane for the stable operation.
Please request the oscillator manufacturer to evaluate the oscillational characteristics of the crystal and this
device.
5.
Notes on using external clock
When using the external clock, it is necessary to simultaneously supply the X0 (X0A) and the X1 (X1A) pins. In
the described combination, X1 (X1A) should be supplied with a clock signal which has the opposite phase to
the X0 (X0A) pins. At X0 and X1, a frequency up to 16 MHz is possible.
(Continued)