參數(shù)資料
型號: MAX9949DCCB+D
廠商: Maxim Integrated Products
文件頁數(shù): 12/23頁
文件大?。?/td> 0K
描述: IC PPMU DUAL SPI 64TQFP
標(biāo)準(zhǔn)包裝: 160
系列: *
MAX9949/MAX9950
Dual Per-Pin Parametric Measurement Units
2
_______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
DC ELECTRICAL CHARACTERISTICS
(VCC = +12V, VEE = -7V, VL = +3.3V, TA = TMIN to TMAX, unless otherwise noted. TA < +25°C guaranteed by design and characterization.
Typical values are at TA = +25°C, unless otherwise specified.) (Note 2)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
VCC to AGND .......................................................................+20V
VEE to AGND.........................................................................-15V
VCC to VEE ...........................................................................+32V
VL to AGND............................................................................+6V
AGND to DGND.....................................................-0.5V to +0.5V
All Other Pins ...................................(VEE - 0.3V) to (VCC + 0.3V)
Digital Inputs/Outputs ......-0.3V to (VL + 0.3V)Continuous Power
Dissipation (TA = +70°C)
64-Pin TQFP-EP (derate 43.5mW/°C above +70°C)....3478mW
θJA (Note 1) ................................................................+23.0°C/W
θJC (Note 1) .....................................................................+8°C/W
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Operating Temperature (commercial) Range ........0°C to +70°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
FORCE VOLTAGE (Note 3)
Force Input Voltage Range
VIN0_,
VIN1_
VEE +
3.5V
VCC -
3.5V
V
VCC = +12V, VEE = -7V
-2
+7
DUT current at
full scale
VCC = +18V, VEE = -12V
-7
+13
Forced Voltage
VDUT
DUT current = 0A
VEE +
3.5V
VCC -
3.5V
V
Input Bias Current
±1
A
Forced-Voltage Offset Error
VFOS
TA = +25°C
-25
+25
mV
Forced-Voltage Offset
Temperature Coefficient
±100
V/°C
Forced-Voltage Gain Error
VFGE
TA = +25°C, nominal gain of +1
-1
0.005
+1
%
Forced-Voltage Gain
Temperature Coefficient
±10
ppm/°C
Forced-Voltage Linearity Error
VFLER
TA = +25°C, gain and offset errors
calibrated out (Notes 4, 5)
-0.02
+0.02
%FSR
MEASURE CURRENT (Note 3)
Measure-Current Offset
IMOS
TA = +25°C (Note 4)
-1
+1
%FSR
Measure-Current Offset
Temperature Coefficient
±20
ppm/°C
Measure-Current Gain Error
IMGE
TA = +25°C (Note 7)
-1
+1
%
Measure-Current Gain
Temperature Coefficient
±20
ppm/°C
Ranges A–D
-0.02
+0.02
%FSR
Linearity Error
IMLER
TA = +25°C, gain, offset, and
common-mode errors
calibrated out (Notes 4, 5, 6)
Range E
-1
+1
nA
VIOS = VDUTGND
-4
+4
Measure Output Voltage Range
over Full Current Range (Note 8)
VMSR
VIOS = 4V + VDUTGND
08
V
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
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