2 ______________________________________________________________________________________
MAX98500
Boosted 2.2W Class D Amplifier
with Automatic Level Control
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
VBAT to AGND.........................................................-0.3V to +6V
VCCOUT to BSTPGND, AGND.................................-0.3V to +6V
PVDD to SPKPGND.................................................-0.3V to +6V
BSTPGND, SPKPGND to AGND ......................... -0.3V to +0.3V
GAIN to AGND ........................................ -0.3V to (VBAT + 0.3V)
SDBST, SDSPK to AGND...................................... -0.3V to VBAT
All Other Pins (excluding LX) to AGND ..................-0.3V to +6V
Current Into/Out of LX, VCCOUT, BSTPGND..................... Q3.9A
Continuous Current Into/Out of SPK_, PVDD,
SPKPGND.................................................................. Q800mA
Continuous Input Current (all other pins)........................ Q20mA
Duration of Short Circuit Between VCCOUT
and BSTPGND...................................................... Continuous
Duration of SPK_ Short Circuit to PVDD or
SPKPGND..............................................................Continuous
Duration of Short Circuit Between SPKP
and SPKN ..............................................................Continuous
Continuous Power Dissipation, Multilayer Board (TA = +70NC)
WLP (derate 20.4mW/NC above +70NC)........................1.33W
θJA (Note 1).................................................................49NC/W
Junction Temperature .....................................................+150NC
Operating Temperature Range.......................... -40NC to +85NC
Storage Temperature Range............................ -65NC to +150NC
Soldering Temperature (reflow) ......................................+260NC
ELECTRICAL CHARACTERISTICS
(VBAT = 3.6V, RL = J between SPKP and SPKN, AV = +6dB, CIN = 1FF, 20Hz to 22kHz AC measurement bandwidth, TA = TMIN to
TMAX, unless otherwise noted. Typical values are at TA = +25NC.) (Note 2)
ABSOLUTE MAXIMUM RATINGS
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
Power-Supply Rejection Ratio
(Note 3)
PSRR
TA = +25NC, VBAT = 2.5V to 5.5V
95
dB
Quiescent Current
IVBAT
TA = +25NC, SDSPK = SDBST = VBAT
3.05
mA
TA = +25NC, VSDSPK = 0V, SDBST = VBAT
0.09
0.15
IPVDD
TA = +25NC, PVDD = 5.55V, SDSPK =
SDBST = VBAT
1.7
2.7
Combined Efficiency
E
POUT = 1.7W, f = 1kHz, ZSPK = 8I + 68FH
87
%
Shutdown Current
ISHDN
VSDSPK = VSDBST = 0V, TA = +25NC
0.04
1.5
F
A
Turn-On Time
tON
Time from power-on to full operation
10
12
ms
BOOST CONVERTER
Battery Supply Voltage Range
VBAT
2.5
5.5
V
Soft-Start Interval
tON
5.6
ms
Undervoltage Lockout
UVLO
VBAT falling
2.1
2.2
2.3
V
Boost Converter Output Voltage
VVCCOUT ILOAD = 0mA
5.45
5.5
5.65
V
Output Current Limit
IMAX
VBAT R = 3.6V
1.5
A
Input Current Limit
ILIMIT
Startup, VCCOUT = 0V
0.3
0.5
A
nMOS Current Limit
ILX,MAX
3.3
A
pMOS Turn-Off Current Limit
10
mA
Switching Frequency
fS
1.8
2.0
2.2
MHz
Efficiency
E
0.1A P IOUT P 0.75A
93
%
Startup Short-Circuit Time
Converter latch off
50
ms
Thermal Shutdown
165
N
C
LX Leakage Current
VLX = 0V or 5.5V,
VCCOUT = 5.5V
TA = +25NC
-1.0
+0.1
+1.0
F
A
-40NC P TA P +85NC
0.1