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參數(shù)資料
| 型號： | MAX9791CETI+T |
| 廠商： | Maxim Integrated Products |
| 文件頁數(shù)： | 19/34頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC AMP AUDIO 2.2W STER D 28WQFN |
| 產品培訓模塊： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 標準包裝： | 2,500 |
| 系列： | DirectDrive® |
| 類型： | D 類 |
| 輸出類型： | 2-通道（立體聲）帶立體聲耳機和超低音器 |
| 在某負載時最大輸出功率 x 通道數(shù)量： | 2.2W x 2 @ 4 歐姆; 180mW x 2 @ 32 歐姆 |
| 電源電壓： | 4.5 V ~ 5.5 V |
| 特點： | 消除爆音，LDO，短路保護和熱保護，關機 |
| 安裝類型： | 表面貼裝 |
| 供應商設備封裝： | 28-TQFN-EP（4x4） |
| 封裝/外殼： | 28-WFQFN 裸露焊盤 |
| 包裝： | 帶卷 (TR) |
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MAX9791/MAX9792
Windows Vista-Compliant Class D Speaker
Amplifiers with DirectDrive Headphone Amplifiers
26
______________________________________________________________________________________
Charge-Pump Output Capacitor (C2)
Connect a 1F capacitor between CPVSS and PGND.
LDO Output Capacitor (CLDO)
Connect 2 x 1F capacitors between LDO_OUT and
GND for 4.75V and 3.3V LDO options (MAX979_A and
MAX979_B, respectively). Connect two parallel 2F
capacitors between LDO_OUT and GND for the 1.8V
LDO option (MAX979_C).
Layout and Grounding
Proper layout and grounding are essential for optimum
performance. Use large traces for the power-supply
inputs and amplifier outputs to minimize losses due to
parasitic trace resistance, as well as route heat away
from the device. Good grounding improves audio per-
formance, minimizes crosstalk between channels, and
prevents switching noise from coupling into the audio
signal. Connect PGND and GND together at a single
point on the PCB. Route PGND and all traces that carry
switching transients away from GND, and the traces
and components in the audio signal path.
Connect C2 to the PGND plane. Place the charge-
pump capacitors (C1, C2) as close as possible to the
device. Bypass PVDD with a 0.1F capacitor to PGND.
Place the bypass capacitors as close as possible to the
device.
The MAX9791/MAX9792 is inherently designed for
excellent RF immunity. For best performance, add
ground fills around all signal traces on top or bottom
PCB planes.
Use large, low-resistance output traces. As load imped-
ance decreases, the current drawn from the device out-
puts increase. At higher current, the resistance of the
output traces decrease the power delivered to the load.
For example, if 2W is delivered from the speaker output
to a 4
load through a 100m trace, 49mW is wasted
in the trace. If power is delivered through a 10m
trace, only 5mW is wasted in the trace. Large output,
supply, and GND traces also improve the power dissi-
pation of the device.
The MAX9791/MAX9792 thin QFN package features an
exposed thermal pad on its underside. This pad lowers
the package’s thermal resistance by providing a direct
heat conduction path from the die to the printed circuit
board. Connect the exposed thermal pad to GND by
using a large pad and multiple vias to the GND plane.
Chip Information
PROCESS: BiCMOS
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相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| MAX9792AETI+ | 功能描述:音頻放大器 Windows Vista Class D Speaker Amp RoHS:否 制造商:STMicroelectronics 產品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
| MAX9792AETI+T | 功能描述:音頻放大器 Windows Vista Class D Speaker Amp RoHS:否 制造商:STMicroelectronics 產品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
| MAX9792AEVKIT+ | 功能描述:音頻放大器 Windows Vista-Compliant Class D Speaker Amplifiers with DirectDrive Headphone Amplifiers RoHS:否 制造商:STMicroelectronics 產品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
| MAX9792CETI+ | 功能描述:音頻放大器 Windows Vista Class D Speaker Amp RoHS:否 制造商:STMicroelectronics 產品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
| MAX9792CETI+T | 功能描述:音頻放大器 Windows Vista Class D Speaker Amp RoHS:否 制造商:STMicroelectronics 產品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
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