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參數(shù)資料
| 型號： | MAX9779ETI+ |
| 廠商： | Maxim Integrated Products |
| 文件頁數(shù)： | 6/19頁 |
| 文件大小： | 0K |
| 描述： | IC AMP AUDIO PWR 2.6W AB 28TQFN |
| 標(biāo)準(zhǔn)包裝： | 60 |
| 系列： | DirectDrive® |
| 類型： | AB 類 |
| 輸出類型： | 2-通道（立體聲）帶立體聲耳機(jī) |
| 在某負(fù)載時最大輸出功率 x 通道數(shù)量： | 2.6W x 2 @ 3 歐姆; 110mW x 2 @ 16 歐姆 |
| 電源電壓： | 4.5 V ~ 5.5 V |
| 特點(diǎn)： | 消除爆音，短路保護(hù)和熱保護(hù)，關(guān)閉 |
| 安裝類型： | 表面貼裝 |
| 供應(yīng)商設(shè)備封裝： | 28-TQFN-EP（5x5） |
| 封裝/外殼： | 28-WFQFN 裸露焊盤 |
| 包裝： | 管件 |
MAX9779
2.6W Stereo Audio Power Amplifier and
DirectDrive Headphone Amplifier
14
______________________________________________________________________________________
For 8
applications, the worst-case power dissipation
occurs when the output power is 1.1W/channel, resulting
in a power dissipation of approximately 1W. In this case,
the TQFN package can be used without violating the
maximum power dissipation or exceeding the thermal
protection threshold. For 4
applications, the TQFN
package may require heatsinking or forced air cooling to
prevent the device from reaching its thermal limit. The
more thermally efficient TQFN package is suggested for
speaker loads less than 8
.
Output Power (Speaker Amplifier)
The increase in power delivered by the BTL configura-
tion directly results in an increase in internal power dis-
sipation over the single-ended configuration. The
maximum power dissipation for a given VDD and load is
given by the following equation:
If the power dissipation for a given application exceeds
the maximum allowed for a given package, either reduce
VDD, increase load impedance, decrease the ambient
temperature, or add heatsinking to the device. Large
output, supply, and ground PC board traces improve the
maximum power dissipation in the package.
Thermal-overload protection limits total power dissipa-
tion in these devices. When the junction temperature
exceeds +160°C, the thermal-protection circuitry dis-
ables the amplifier output stage. The amplifiers are
enabled once the junction temperature cools by 15°C.
This results in a pulsing output under continuous ther-
mal-overload conditions as the device heats and cools.
Output Power (Headphone Amplifier)
The headphone amplifiers have been specified for the
worst-case scenario—when both inputs are in phase.
Under this condition, the drivers simultaneously draw
current from the charge pump, leading to a slight loss in
headroom of VSS. In typical stereo audio applications,
the left and right signals have differences in both magni-
tude and phase, subsequently leading to an increase in
the maximum attainable output power. Figure 7 shows
the two extreme cases for in and out of phase. In reality,
the available power lies between these extremes.
Power Supplies
The MAX9779 has different supplies for each portion of
the device, allowing for the optimum combination of
headroom, power dissipation, and noise immunity. The
speaker amplifiers are powered from PVDD. PVDD
ranges from 4.5V to 5.5V. The headphone amplifiers are
powered from HPVDD and VSS. HPVDD is the positive
supply of the headphone amplifiers and ranges from 3V
to 5.5V. VSS is the negative supply of the headphone
amplifiers. Connect VSS to CPVSS. The charge pump is
powered by CPVDD. CPVDD ranges from 3V to 5.5V and
should be the same potential as HPVDD. The charge
pump inverts the voltage at CPVDD, and the resulting
voltage appears at CPVSS. The remainder of the device
is powered by VDD.
Component Selection
Input Filtering
The input capacitor (CIN), in conjunction with the ampli-
fier input resistance (RIN), forms a highpass filter that
removes the DC bias from an incoming signal (see the
Block Diagram). The AC-coupling capacitor allows the
amplifier to bias the signal to an optimum DC level.
Assuming zero source impedance, the -3dB point of
the highpass filter is given by:
RIN is the amplifier’s internal input resistance value
given in the Electrical Characteristics. Choose CIN such
that f-3dB is well below the lowest frequency of interest.
Setting f-3dB too high affects the amplifier’s low-fre-
quency response. Use capacitors with low-voltage
coefficient dielectrics, such as tantalum or aluminum
electrolytic. Capacitors with high-voltage coefficients,
such as ceramics, may result in increased distortion at
low frequencies.
f
RC
dB
IN IN
=
3
1
2
π
P
V
R
DISS MAX
DD
L
() =
2
π
OUTPUT POWER (mW)
THD+N
(%)
125
100
75
50
25
0.01
0.1
1
10
100
1000
0.001
0
150
VDD = 5V
RL = 16
AV = 3dB
OUTPUTS IN PHASE
OUTPUTS 180
° OUT OF PHASE
Figure 7. Total Harmonic Distortion Plus Noise vs. Output Power
with Inputs In/Out of Phase (Headphone Mode)
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| MAX9779ETI+ | 功能描述:音頻放大器 Integrated Circuits (ICs) RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
| MAX9779ETI+T | 功能描述:音頻放大器 Integrated Circuits (ICs) RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
| MAX977EEE | 功能描述:校驗(yàn)器 IC 3V/5V Dual-Speed Comparator RoHS:否 制造商:STMicroelectronics 產(chǎn)品: 比較器類型: 通道數(shù)量: 輸出類型:Push-Pull 電源電壓-最大:5.5 V 電源電壓-最小:1.1 V 補(bǔ)償電壓（最大值）:6 mV 電源電流（最大值）:1350 nA 響應(yīng)時間: 最大工作溫度:+ 125 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SC-70-5 封裝:Reel |
| MAX977EEE+ | 功能描述:校驗(yàn)器 IC 3V/5V Dual-Speed Comparator RoHS:否 制造商:STMicroelectronics 產(chǎn)品: 比較器類型: 通道數(shù)量: 輸出類型:Push-Pull 電源電壓-最大:5.5 V 電源電壓-最小:1.1 V 補(bǔ)償電壓（最大值）:6 mV 電源電流（最大值）:1350 nA 響應(yīng)時間: 最大工作溫度:+ 125 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SC-70-5 封裝:Reel |
| MAX977EEE+T | 功能描述:校驗(yàn)器 IC 3V/5V Dual-Speed Comparator RoHS:否 制造商:STMicroelectronics 產(chǎn)品: 比較器類型: 通道數(shù)量: 輸出類型:Push-Pull 電源電壓-最大:5.5 V 電源電壓-最小:1.1 V 補(bǔ)償電壓（最大值）:6 mV 電源電流（最大值）:1350 nA 響應(yīng)時間: 最大工作溫度:+ 125 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SC-70-5 封裝:Reel |
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