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參數(shù)資料
| 型號： | MAX9773ETG+ |
| 廠商： | Maxim Integrated Products |
| 文件頁數(shù)： | 9/21頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC AMP AUDIO PWR 1.8W D 24TQFN |
| 標(biāo)準(zhǔn)包裝： | 75 |
| 類型： | D 類 |
| 輸出類型： | 2 通道（立體聲） |
| 在某負(fù)載時(shí)最大輸出功率 x 通道數(shù)量： | 1.8W x 2 @ 4 歐姆 |
| 電源電壓： | 2.6 V ~ 5.5 V |
| 特點(diǎn)： | 消除爆音，差分輸入，短路和熱保護(hù)，關(guān)閉 |
| 安裝類型： | 表面貼裝 |
| 供應(yīng)商設(shè)備封裝： | 24-TQFN-EP（4x4） |
| 封裝/外殼： | 24-WFQFN 裸露焊盤 |
| 包裝： | 管件 |
Low frequencies are summed through a two-pole low-
pass filter and sent to the MAX9705 mono speaker
amplifier. The passband gain of the lowpass filter is
unity for in-phase stereo signals:
where R1 = R2 and R3 = R1//R2. The cutoff frequency
of the lowpass filter is set by the following equation:
Supply Bypassing, Layout, and Grounding
Proper layout and grounding are essential for optimum
performance. Use large traces for the power-supply
inputs and amplifier outputs to minimize losses due to
parasitic trace resistance. Large traces also aid in moving
heat away from the package. Proper grounding improves
audio performance, minimizes crosstalk between chan-
nels, and prevents any switching noise from coupling into
the audio signal. Connect PGND and GND together at a
single point on the PC board. Route all traces that carry
switching transients away from GND and the traces/com-
ponents in the audio signal path.
Bypass VDD with a 0.1F capacitor to GND and PVDD
with a 10F capacitor to PGND. Place the bypass
capacitors as close to the MAX9773 as possible. Use
large, low-resistance output traces. Current drawn from
the outputs increases as load impedance decreases.
High-output trace resistance decreases the power deliv-
ered to the load. Large output, supply, and GND traces
allow more heat to move from the MAX9773 to the air,
decreasing the thermal impedance of the circuit.
The MAX9773 thin QFN-EP package features an
exposed thermal pad on its underside. This pad lowers
the package’s thermal impedance by providing a direct
heat conduction path from the die to the PC board.
Connect the exposed thermal pad to the GND plane.
UCSP Applications Information
For the latest application details on UCSP construction,
dimensions, tape carrier information, printed circuit board
techniques, bump-pad layout, and recommended reflow
temperature profile, as well as the latest information on
reliability testing results, refer to Application Note:
UCSP—A Wafer-Level Chip-Scale Package available on
Maxim’s website at www.maxim-ic.com/ucsp.
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MAX9773
1.8W, Filterless, Ultra-Low EMI,
Stereo Class D Audio Power Amplifier
______________________________________________________________________________________
17
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MAX9773ETG+ | 功能描述:音頻放大器 Integrated Circuits (ICs) RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
| MAX9773ETG+T | 功能描述:音頻放大器 Integrated Circuits (ICs) RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
| MAX9773EWP+G45 | 制造商:Rochester Electronics LLC 功能描述: 制造商:Maxim Integrated Products 功能描述: |
| MAX9773EWP+TG45 | 制造商:Rochester Electronics LLC 功能描述: 制造商:Maxim Integrated Products 功能描述: |
| MAX9775EBX+G45 | 制造商:Rochester Electronics LLC 功能描述: 制造商:Maxim Integrated Products 功能描述: |
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