參數(shù)資料
型號(hào)： MAX9760EUI+T
廠商： Maxim Integrated Products
文件頁(yè)數(shù)： 14/31頁(yè)
文件大小： 0K
描述： IC AMP AUDIO PWR 3W STER 28TSSOP
標(biāo)準(zhǔn)包裝： 2,500
類型： AB 類
輸出類型： 2-通道（立體聲）帶立體聲耳機(jī)
在某負(fù)載時(shí)最大輸出功率 x 通道數(shù)量： 3W x 2 @ 3 歐姆; 200mW x 2 @ 16 歐姆
電源電壓： 4.5 V ~ 5.5 V
特點(diǎn)： 消除爆音，I²C，輸入多路復(fù)用器，靜音，關(guān)機(jī)，熱保護(hù)
安裝類型： 表面貼裝
供應(yīng)商設(shè)備封裝： 28-TSSOP 裸露焊盤
封裝/外殼： 28-SOIC（0.173"，4.40mm 寬）裸露焊盤
包裝： 帶卷 (TR)
MAX9760–MAX9763
Stereo 3W Audio Power Amplifiers with
Headphone Drive and Input Mux
______________________________________________________________________________________
21
depending on the status of the gain control input. The
stereo MAX9760/MAX9761 feature two gain options per
channel. The mono MAX9762/MAX9763 feature two
gain options per single-ended channel, and a single
gain option for the mono speaker amplifier (see Tables
1a and 1b for the gain-setting options).
The MAX9762 defaults to GAINM in speaker mode and
can switch between GAINA and GAINB in headphone
mode.
Bass Boost Circuit
Headphones typically have a poor low-frequency
response due to speaker and enclosure size limitations.
A bass boost circuit compensates the poor low-frequen-
cy response (Figure 9). At low frequencies, the capaci-
tor CF is an open circuit, and the effective impedance in
the feedback loop (RF(EFF)) is RF(EFF) = RF1.
At the frequency:
where the impedance, CF, begins to decrease, and at
high frequencies, the CF is a short circuit. Here the
impedance of the feedback loop is:
Assuming RF1 = RF2, then RF(EFF) at low frequencies is
twice that of RF(EFF) at high frequencies (Figure 10).
Thus, the amplifier has more gain at lower frequencies,
boosting the system’s bass response. Set the gain roll-
off frequency based upon the response of the speaker
and enclosure.
Layout and Grounding
Good PC board layout is essential for optimizing perfor-
mance. Use large traces for the power-supply inputs
and amplifier outputs to minimize losses due to para-
sitic trace resistance, as well as route heat away from
the device. Good grounding improves audio perfor-
mance, minimizes crosstalk between channels, and
prevents any digital switching noise from coupling into
the audio signal. If digital signal lines must cross over
or under audio signal lines, ensure that they cross per-
pendicular to each other.
The MAX9760–MAX9763 QFN and TSSOP-EP pack-
ages feature exposed thermal pads on their under-
sides. This pad lowers the package’s thermal
resistance by providing a direct heat conduction path
from the die to the printed circuit board. Connect the
pad to signal ground by using a large pad, or multiple
vias to the ground plane.
R
RR
F EFF
FF
() =
×
+
12
1
2
πRC
FF
VBIAS
RIN
RF2
RF1
CF
Figure 9. Bass Boost Circuit
RF1
RF1 RF2
RIN
2
π RF2 CF
1
FREQUENCY
GAIN
Figure 10. Bass Boost Response
相關(guān)PDF資料
PDF描述
MAX9761EUI+T IC AMP AUDIO PWR 3W STER 28TSSOP
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MAX9760EVKIT 功能描述:放大器 IC 開發(fā)工具 RoHS:否 制造商:International Rectifier 產(chǎn)品:Demonstration Boards 類型:Power Amplifiers 工具用于評(píng)估:IR4302 工作電源電壓:13 V to 23 V
MAX9760EVSYS 功能描述:放大器 IC 開發(fā)工具 RoHS:否 制造商:International Rectifier 產(chǎn)品:Demonstration Boards 類型:Power Amplifiers 工具用于評(píng)估:IR4302 工作電源電壓:13 V to 23 V
MAX9761ETI 功能描述:音頻放大器 RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel
MAX9761ETI+ 功能描述:音頻放大器 Integrated Circuits (ICs) RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel
MAX9761ETI+T 功能描述:音頻放大器 Integrated Circuits (ICs) RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel
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