參數(shù)資料
型號: MAX9757ETJ+T
廠商: Maxim Integrated Products
文件頁數(shù): 4/31頁
文件大?。?/td> 0K
描述: IC AMP AUDIO PWR 2.3W AB 32TQFN
標準包裝: 2,500
系列: DirectDrive®
類型: AB 類
輸出類型: 2-通道(立體聲)帶立體聲耳機
在某負載時最大輸出功率 x 通道數(shù)量: 2.3W x 2 @ 3 歐姆; 130mW x 2 @ 16 歐姆
電源電壓: 4.5 V ~ 5.5 V
特點: 消除爆音,短路保護和熱保護,關機,音量控制
安裝類型: 表面貼裝
供應商設備封裝: 32-TQFN-EP(5x5)
封裝/外殼: 32-WFQFN 裸露焊盤
包裝: 帶卷 (TR)
MAX9756/MAX9757/MAX9758
2.3W Stereo Speaker Amplifiers and DirectDrive
Headphone Amplifiers with Automatic Level Control
12
______________________________________________________________________________________
Pin Description (continued)
PIN
MAX9756
MAX9757
MAX9758
NAME
FUNCTION
10
9
CPVDD
Charge-Pump Power Supply. Bypass with 1F ceramic capacitor to CPGND.
11
10
C1P
Charge-Pump Flying-Capacitor Positive Terminal. Connect a 1F capacitor from C1P
to C1N.
12
11
CPGND
Charge-Pump Ground
13
12
C1N
Charge-Pump Flying-Capacitor Negative Terminal. Connect a 1F capacitor from
C1P to C1N.
14
13
CPVSS
Charge-Pump Negative Output. Connect to VSS.
15
14
VSS
Headphone Amplifier Negative Power Supply. Bypass with 1F ceramic capacitor to
GND.
16
15
HPR
Right Headphone Output
17
16
HPL
Left Headphone Output
18
17
HPVDD
Headphone Positive Power Supply. Bypass with 1F ceramic capacitor to GND.
20
19
OUTR-
Right-Channel Negative Speaker Output
21
20
OUTR+
Right-Channel Positive Speaker Output
23
22
HPS
Headphone Sense Input. Leave HPS unconnected if automatic headphone sensing
is not used.
24
23
REGEN
LDO Enable. Connect REGEN to VDD to enable the LDO. Connect to GND to
disable LDO.
25
23
DR
Automatic Level Control Attack to Release Time Ratio Select. Hardwired to VDD,
GND, or BIAS to set the attack to release ratio; see the ALC section.
26
24
BIAS
Common-Mode Bias Voltage. Bypass with a 1.0F capacitor to GND.
27
25
SHDN
Shutdown Input. Drive
SHDN low to disable the audio amplifiers. Connect SHDN to
VDD for normal operation.
28
26
VOL
Analog Volume Control Input
29
27
PREF
Power-Limiting Input. Connect a resistor from PREF to GND to set the speaker output
clamping level. Leave PREF unconnected to disable ALC; see the ALC section.
30
27
SET
Regulator Feedback Input. Connect to GND for 4.65V fixed output. Connect to
resistor-divider for adjustable output; see the Low-Dropout Linear Regulator section.
31
28
GND
Ground
32
29
VDD
Power Supply
33
IN
LDO Input. Bypass with two 1F ceramic capacitors to GND.
34
30
OUT
LDO Output. Bypass with two 1F ceramic capacitors to GND.
35
30
CT
Automatic Level Control Attack and Release Timing Capacitor. Connect CT to GND
to disable ALC; see the ALC section.
36
31
INR
Right-Channel Audio Input
29
VDD
Power-Supply and LDO Input. Bypass with two 1F ceramic capacitors to GND.
EP
Exposed Pad. The external pad lowers the package’s thermal impedance by
providing a direct-heat conduction path from the die to the PC board. Connect the
exposed thermal pad to GND.
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