參數(shù)資料
型號: MAX9750BETI+T
廠商: Maxim Integrated Products
文件頁數(shù): 13/30頁
文件大?。?/td> 0K
描述: IC AMP AUDIO PWR 2.6W AB 28TQFN
標準包裝: 2,500
系列: DirectDrive®
類型: AB 類
輸出類型: 2-通道(立體聲)帶立體聲耳機
在某負載時最大輸出功率 x 通道數(shù)量: 2.6W x 2 @ 3 歐姆; 110mW x 2 @ 16 歐姆
電源電壓: 4.5 V ~ 5.5 V
特點: 消除爆音,短路保護和熱保護,關(guān)機,音量控制
安裝類型: 表面貼裝
供應(yīng)商設(shè)備封裝: 28-TQFN-EP(5x5)
封裝/外殼: 28-WFQFN 裸露焊盤
包裝: 帶卷 (TR)
MAX9750/MAX9751/MAX9755
2.6W Stereo Audio Power Amplifiers and
DirectDrive Headphone Amplifiers
20
______________________________________________________________________________________
Applications Information
BTL Speaker Amplifiers
The MAX9750/MAX9751/MAX9755 feature speaker
amplifiers designed to drive a load differentially, a con-
figuration referred to as bridge-tied load (BTL). The BTL
configuration (Figure 9) offers advantages over the sin-
gle-ended configuration, where one side of the load is
connected to ground. Driving the load differentially
doubles the output voltage compared to a single-
ended amplifier under similar conditions. Thus, the
device’s differential gain is twice the closed-loop gain
of the input amplifier. The effective gain is given by:
Substituting 2 x VOUT(P-P) into the following equation
yields four times the output power due to double the
output voltage:
Since the differential outputs are biased at midsupply,
there is no net DC voltage across the load. This elimi-
nates the need for DC-blocking capacitors required for
single-ended amplifiers. These capacitors can be large
and expensive, can consume board space, and can
degrade low-frequency performance.
Power Dissipation and Heat Sinking
Under normal operating conditions, the MAX9750/
MAX9751/MAX9755 can dissipate a significant amount
of power. The maximum power dissipation for each
package is given in the
Absolute Maximum Ratings
under Continuous Power Dissipation, or can be calcu-
lated by the following equation:
where TJ(MAX) is +150°C, TA is the ambient tempera-
ture, and
θJA is the reciprocal of the derating factor in
°C/W as specified in the
Absolute Maximum Ratings
section. For example,
θJA of the thin QFN package is
+42°C/W. For optimum power dissipation, the exposed
paddle of the package should be connected to the
ground plane (see the
Layout and Grounding section).
Output Power (Speaker Amplifier)
The increase in power delivered by the BTL configura-
tion directly results in an increase in internal power dis-
sipation over the single-ended configuration. The
maximum power dissipation for a given VDD and load is
given by the following equation:
If the power dissipation for a given application exceeds
the maximum allowed for a given package, either reduce
VDD, increase load impedance, decrease the ambient
temperature, or add heatsinking to the device. Large
output, supply, and ground PC board traces improve the
maximum power dissipation in the package.
P
V
R
DISS MAX
DD
L
() =
2
π
P
TT
DISSPKG MAX
J MAX
A
JA
()
=
θ
V
P
V
R
RMS
OUT P P
OUT
RMS
L
=
()
22
2
A
R
VD
F
IN
2
+1
VOUT(P-P)
2 x VOUT(P-P)
VOUT(P-P)
-1
Figure 9. Bridge-Tied Load Configuration
OUTPUT POWER (mW)
THD+N
(%)
125
100
75
50
25
0.01
0.1
1
10
100
1000
0.001
0
150
VDD = 5V
RL = 16
Ω
AV = 3dB
OUTPUTS IN PHASE
OUTPUTS 180
° OUT OF PHASE
Figure 10. Total Harmonic Distortion Plus Noise vs. Output Power
with Inputs In/Out of Phase (Headphone Mode)
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