參數(shù)資料
型號: MAX9726BETP+
廠商: Maxim Integrated Products
文件頁數(shù): 13/24頁
文件大小: 0K
描述: IC AMP AUDIO .124W STER 20TQFN
標準包裝: 75
系列: DirectDrive®
類型: AB 類
輸出類型: 耳機,2-通道(立體聲)
在某負載時最大輸出功率 x 通道數(shù)量: 124mW x 2 @ 16 歐姆
電源電壓: 2.7 V ~ 5.5 V
特點: 低音增強模式,消除爆音,I²C,靜音,短路和熱保護,關機,音量控制
安裝類型: 表面貼裝
供應商設備封裝: 20-TQFN-EP(4x4)
封裝/外殼: 20-WFQFN 裸露焊盤
包裝: 管件
MAX9726
Summing Amplifier (Audio Mixer)
Figure 10 shows the MAX9726 configured as a sum-
ming amplifier, which allows multiple audio sources to
be linearly mixed together. Using this configuration, the
output of the MAX9726 is equal to the weighted sum of
the input signals:
As shown in the above equation, the weighting or
amount of gain applied to each input signal source is
determined by the ratio of RF and the respective input
resistor (RIN1, RIN2, RIN3) connected to each signal
source. When BassMax is enabled, the low-frequency
gain (ABOOST) set by R1, R2, and C3 (see the Gain-
Setting Components section) adds to the gain deter-
mined by RF and RIN_. Select RF and RIN_ such that the
dynamic range of the MAX9726 is not exceeded when
BassMax is enabled and/or when the input signals are
at their maximum values and in phase with each other.
Layout and Grounding
Proper layout and grounding are essential for optimum
performance. Connect PGND and SGND together at a
single point (star ground point) on the PC board.
Connect PVSS to SVSS at the device and bypass this
connection with a 1F capacitor to PGND. Bypass VDD,
PREG, and NREG to PGND with a 1F capacitor. Place
the power-supply bypass capacitor and the charge-
pump hold capacitor as close as possible to the
MAX9726. Route PGND, and all traces that carry
switching transients, away from SGND and the audio
signal path. Route digital signal traces away from the
audio signal path. Make traces perpendicular to each
other when routing digital signals over or under audio
signals.
The TQFN package features an exposed pad that
improves thermal efficiency.
Ensure that the exposed
pad is electrically isolated from PGND, SGND, and
VDD. Connect the exposed pad to PVSS when the
board layout dictates that the exposed pad cannot
be left unconnected.
UCSP Applications Information
For the latest application details on UCSP construction,
dimensions, tape carrier information, PC board tech-
niques, bump-pad layout, and recommended reflow
temperature profile, as well as the latest information on
reliability testing results, go to Maxim’s website at
www.maxim-ic.com/ucsp and look up the Application
Note:
UCSP—A Wafer-Level Chip-Scale Package.
VV
R
V
R
V
R
OUT
IN
F
IN
F
IN
F
IN
_ =+
+
1
2
3
DirectDrive, Headphone Amplifier with
BassMax, I2C, Volume and Gain Control
20
______________________________________________________________________________________
DIAGRAM SHOWN WITH BassMax DISABLED.
RF
RIN2
FB_
IN_
TO
ATTENUATOR
STAGE
VFB_ =
+
VIN1
RF
-(
)
RIN1
MAX9726
+
VIN2
RF
RIN2
VIN3
RF
RIN3
CIN
VIN2
RIN1
CIN
VIN1
RIN3
CIN
VIN3
Figure 10. Summing Amplifier
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