
M
1.8W, Filterless, Stereo, Class D Audio Power
Amplifier and DirectDrive Stereo Headphone Amplifier
______________________________________________________________________________________
31
Package Information (continued)
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information
go to
www.maxim-ic.com/packages
.)
COMMON DIMENSIONS
3.35
2.80
3.35
2.80
2.80
3.15
2.60
3.15
2.60
2.60
T2855-1
T2855-2
T2855-3
T2855-4
T2855-5
3.25
2.70
3.25
2.70
2.70
3.35
2.80
3.35
2.80
2.80
3.15
2.60
3.15
2.60
2.60
3.25
2.70
3.25
2.70
2.70
MAX.
3.20
3.20
3.20
3.20
3.20
3.20
3.35
EXPOSED PAD VARIATIONS
3.00
3.00
3.00
3.15
T2055-2
T2055-3
T2055-4
T2055-5
3.10
3.10
3.10
3.25
D2
NOM.
3.10
3.10
3.10
MIN.
3.00
3.00
3.00
3.20
3.20
3.20
3.35
3.00
3.00
3.00
3.15
3.10
3.10
3.10
3.25
MIN.
3.00
3.00
3.00
E2
NOM. MAX.
3.10
3.10
3.10
NE
ND
PKG.
CODES
T1655-1
T1655-2
T1655N-1
1. DIMENSIONING & TOLERANCING CONFORM TO ASME Y14.5M-1994.
2. ALL DIMENSIONS ARE IN MILLIMETERS. ANGLES ARE IN DEGREES.
3. N IS THE TOTAL NUMBER OF TERMINALS.
4. THE TERMINAL #1 IDENTIFIER AND TERMINAL NUMBERING CONVENTION SHALL
CONFORM TO JESD 95-1 SPP-012. DETAILS OF TERMINAL #1 IDENTIFIER ARE
OPTIONAL, BUT MUST BE LOCATED WITHIN THE ZONE INDICATED. THE TERMINAL #1
IDENTIFIER MAY BE EITHER A MOLD OR MARKED FEATURE.
5. DIMENSION b APPLIES TO METALLIZED TERMINAL AND IS MEASURED BETWEEN
0.25 mm AND 0.30 mm FROM TERMINAL TIP.
6. ND AND NE REFER TO THE NUMBER OF TERMINALS ON EACH D AND E SIDE RESPECTIVELY.
7. DEPOPULATION IS POSSIBLE IN A SYMMETRICAL FASHION.
8. COPLANARITY APPLIES TO THE EXPOSED HEAT SINK SLUG AS WELL AS THE TERMINALS.
9. DRAWING CONFORMS TO JEDEC MO220, EXCEPT EXPOSED PAD DIMENSION FOR T2855-1,
T2855-3, AND T2855-6.
NOTES:
SYMBOL
A
PKG.
N
L1
e
k
L
E
D
b
A3
A1
10. WARPAGE SHALL NOT EXCEED 0.10 mm.
JEDEC
3.20
3.20
3.20
0.70
0
0.80
0.05
0.75
0.02
4.90
4.90
0.25
0.25
0.30
-
-
-
4
4
WHHB
16
0.35
5.10
5.10
0.30
5.00
5.00
0.80 BSC.
0.20 REF.
MIN.
MAX.
NOM.
16L 5x5
3.10
3.10
3.10
3.10
3.30
T3255-2
T3255-3
T3255-4
T3255N-1
T4055-1
3.00
3.00
3.00
3.00
3.20
3.20
3.20
3.20
3.20
3.40
3.00
3.00
3.00
3.00
3.20
3.10
3.10
3.10
3.10
3.30
3.20
3.20
3.20
3.20
3.40
0.50
-
0.40
-
-
-
-
WHHC
20
5
5
5.00
0.65 BSC.
0.25
5.00
0.30
0.55
0.45
4.90
4.90
0.25
0.65
-
-
5.10
5.10
0.35
20L 5x5
NOM.
MIN.
0.20 REF.
0.75
0.02
0
0.70
0.05
0.80
MAX.
-
-
-
WHHD-1
28
7
7
5.00
0.50 BSC.
0.25
5.00
0.25
0.55
0.45
4.90
4.90
0.20
0.65
-
-
5.10
5.10
0.30
28L 5x5
NOM.
MIN.
0.20 REF.
0.75
0.02
0
0.70
0.05
0.80
MAX.
-
-
-
WHHD-2
32
8
8
5.00
5.00
0.40
0.50 BSC.
0.25
0.30
4.90
4.90
0.50
-
-
5.10
5.10
32L 5x5
NOM.
MIN.
0.20 REF.
0.20 0.25 0.30
0.75
0.02
0
0.70
0.05
0.80
MAX.
DOWN
BONDS
ALLOWED
NO
YES
NO
YES
NO
YES
T2855-6
T2855-7
T2855-8
3.15
2.60
3.15
3.25
2.70
3.25
3.35
2.80
3.35
3.15
2.60
3.15
3.25
2.70
3.25
3.35
2.80
3.35
NO
NO
NO
YES
YES
NO
YES
NO
NO
YES
YES
NO
NO
YES
3.35
3.15
T2855N-1
3.25
3.15
3.25
3.35
NO
L
0.40
0.40
**
**
**
**
**
**
**
**
**
**
**
**
**
**
**
**
**
**
**
**
SEE COMMON DIMENSIONS TABLE
±0.15
11. MARKING IS FOR PACKAGE ORIENTATION REFERENCE ONLY.
H
2
2
21-0140
PACKAGE OUTLINE,
16, 20, 28, 32, 40L THIN QFN, 5x5x0.8mm
-DRAWING NOT TO SCALE-
12. NUMBER OF LEADS SHOWN ARE FOR REFERENCE ONLY.
0.05
0
0.02
0.60
0.40 0.50
0.30
10
-----
40
10
0.40 0.50
5.10
4.90 5.00
0.40 BSC.
0.25 0.35 0.45
0.15
4.90
0.25
0.20
5.00 5.10
0.20 REF.
0.70
MIN.
0.75 0.80
NOM.
40L 5x5
MAX.
13. LEAD CENTERLINES TO BE AT TRUE POSITION AS DEFINED BY BASIC DIMENSION "e", ±0.05.
The MAX9702 thin QFN-EP package features an exposed thermal pad on its underside. This pad lowers the package’s
thermal impedance by providing a direct-heat conduction path from the die to the printed circuit board. The exposed pad
is internally connected to VSS. Connect the exposed thermal pad to an isolated plane.