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參數(shù)資料
| 型號(hào)： | MAX9647AUK+T |
| 廠商： | Maxim Integrated Products |
| 文件頁(yè)數(shù)： | 4/11頁(yè) |
| 文件大小： | 0K |
| 描述： | IC COMPARATOR GP SGL SOT23-5 |
| 標(biāo)準(zhǔn)包裝： | 2,500 |
| 類型： | 通用 |
| 元件數(shù)： | 1 |
| 輸出類型： | 開(kāi)路漏極 |
| 電壓 - 電源，單路/雙路(±)： | 1.8 V ~ 5.5 V |
| 電壓 - 輸入偏移（最小值）： | 7mV @ 5V |
| 電流 - 輸入偏壓（最小值）： | 0.25µA @ 5V |
| 電流 - 輸出（標(biāo)準(zhǔn)）： | 35mA @ 5V |
| 電流 - 靜態(tài)（最大值）： | 120µA |
| CMRR, PSRR（標(biāo)準(zhǔn)）： | 90dB PSRR |
| 傳輸延遲（最大）： | 110ns |
| 工作溫度： | -40°C ~ 125°C |
| 封裝/外殼： | * |
| 安裝類型： | * |
| 包裝： | * |
MAX9647/MAX9648
General-Purpose, Low-Voltage,
Tiny Pack Comparators
2
Maxim Integrated
Supply Voltage (VDD to VSS)...................................-0.3V to +6V
All Other Pins Except OUT............ (VSS - 0.3V) to (VDD + 0.3V)
Differential Input Voltage (IN+ to IN-) ............................... ±3.6V
OUT ............................................................... (VSS - 03V) to +6V
Continuous Power Dissipation (TA = +70NC)
SC70 (derate 3.1mW/NC above +70NC).......................247mW
SOT23 (derate 3.9mW/NC above +70NC) .................312.6mW
Operating Temperature Range........................ -40NC to +125NC
Junction Temperature .....................................................+150NC
Storage Temperature Range............................ -65NC to +150NC
Lead Temperature (soldering, 10s) ................................+300NC
Soldering Temperature (reflow) ......................................+260NC
ABSOLUTE MAXIMUM RATINGS
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-
tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
DC ELECTRICAL CHARACTERISTICS—2.7V OPERATION
(VDD = 2.7V, VSS = 0V, VCM = 0V, RL = 5.1kI connected to VDD, typical values are at TA = +25NC, unless otherwise noted. Boldface
limits apply at the defined temperature extremes.) (Note 2)
SC70
Junction-to-Ambient Thermal Resistance (ΘJA).............324°C/W
Junction-to-Case Thermal Resistance (ΘJC)..................115°C/W
SOT23
Junction-to-Ambient Thermal Resistance (ΘJA)..........255.9°C/W
Junction-to-Case Thermal Resistance (ΘJC)....................81°C/W
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
Input Offset Voltage
VOS
0.4
7
mV
Input Voltage Hysteresis
VHYST
MAX9648 only
2
mV
Input Offset Voltage Average
Temperature Drift
TCVOS
1.5
F
V/NC
Input Bias Current
IB
TA = +25NC
Q
0.0003
Q
250
nA
TA = -40NC to +85NC
±400
TA = -40NC to +125NC
±400
Input Offset Current
IOS
TA = +25NC
Q
0.0003
Q
50
nA
TA = -40NC to +85NC
±150
TA = -40NC to +125NC
±150
Input Voltage Range
VCM
-0.1
V
2.0
Voltage Gain
AV
MAX9647 only
500
V/mV
Output Saturation Voltage
VSAT
ISINK P 1mA
25
mV
Output Sink Current
IO
VO P 1.5V
5
16
mA
Supply Current
IS
(Note 3)
52
100
A
Output Leakage Current
TA = +25NC
0.005
F
A
TA = -40NC to +85NC
1
TA = -40NC to +125NC
2
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