參數(shù)資料
型號: MAX6642ATT94+T
廠商: Maxim Integrated
文件頁數(shù): 12/14頁
文件大?。?/td> 154K
描述: IC TEMP SENSOR SMBUS 6TDFN
產(chǎn)品培訓(xùn)模塊: Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
標(biāo)準(zhǔn)包裝: 2,500
功能: 溫度監(jiān)控系統(tǒng)(傳感器)
傳感器類型: 內(nèi)部和外部
感應(yīng)溫度: -40°C ~ 125°C,0°C ~ 150°C
精確度: ±3°C(最小值)
拓?fù)洌?/td> ADC,多路復(fù)用器,寄存器庫
輸出類型: I²C?/SMBus?
輸出警報:
輸出風(fēng)扇:
電源電壓: 3 V ~ 5.5 V
工作溫度: -40°C ~ 125°C
安裝類型: 表面貼裝
封裝/外殼: 6-WDFN 裸露焊盤
供應(yīng)商設(shè)備封裝: 6-TDFN 裸露焊盤(3x3)
包裝: 帶卷 (TR)
Cable resistance also affects remote-sensor accuracy.
For every 1?of series resistance, the error is approxi-
mately 1/2癈.
Thermal Mass and Self-Heating
When sensing local temperature, this device is intend-
ed to measure the temperature of the PCB to which it is
soldered. The leads provide a good thermal path
between the PCB traces and the die. Thermal conduc-
tivity between the die and the ambient air is poor by
comparison, making air temperature measurements
impractical. Because the thermal mass of the PCB is far
greater than that of the MAX6642, the device follows
temperature changes on the PCB with little or no per-
ceivable delay.
When measuring temperature of a CPU or other IC with
an on-chip sense junction, thermal mass has virtually
no effect; the measured temperature of the junction
tracks the actual temperature within a conversion cycle.
When measuring temperature with discrete remote sen-
sors, smaller packages, such as SOT23s, yield the best
thermal response times. Take care to account for ther-
mal gradients between the heat source and the sensor,
and ensure that stray air currents across the sensor
package do not interfere with measurement accuracy.
Self-heating does not significantly affect measurement
accuracy. Remote-sensor self-heating due to the diode
current source is negligible. For the local diode, the
worst-case error occurs when autoconverting at the
fastest rate and simultaneously sinking maximum cur-
rent at the ALERT output. For example, with V
CC
=
+5.0V, at an 8Hz conversion rate and with ALERT sink-
ing 1mA, the typical power dissipation is:
5.0V x 450礎(chǔ) + 0.4V x 1mA = 2.65mW
?/DIV>
J-A
for the 6-pin TDFN package is about +41癈/W, so
assuming no copper PCB heat sinking, the resulting
temperature rise is:
擳 = 2.65mW x 41癈/W = +0.11癈
Even under nearly worst-case conditions, it is difficult to
introduce a significant self-heating error.
?癈, SMBus-Compatible Remote/Local
Temperature Sensor with Overtemperature Alarm
12   ______________________________________________________________________________________
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