參數(shù)資料
型號: MAX6581TG9A+
廠商: Maxim Integrated
文件頁數(shù): 2/27頁
文件大?。?/td> 1212K
描述: IC TEMP SENSOR 8-CH PREC 24-TQFN
產(chǎn)品培訓(xùn)模塊: Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
標(biāo)準(zhǔn)包裝: 75
功能: 溫度監(jiān)控器
傳感器類型: 內(nèi)部和外部
感應(yīng)溫度: -64°C ~ 150°C
精確度: ±3°C 本地(最大),±2.5°C 遠(yuǎn)程(最大)
輸出類型: I²C?/SMBus?
輸出警報:
輸出風(fēng)扇:
電源電壓: 3 V ~ 3.6 V
工作溫度: -40°C ~ 125°C
安裝類型: 表面貼裝
封裝/外殼: 24-WFQFN 裸露焊盤
供應(yīng)商設(shè)備封裝: 24-TQFN-EP(4x4)
包裝: 管件
2
Maxim Integrated
?癈 Accurate 8-Channel Temperature Sensor
MAX6581
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
(All voltages referenced to GND.)
V
CC
, SMBCLK, SMBDATA, ALERT,
OVERT, STBY to GND .........................................-0.3V to +4V
DXP_ to GND ............................................ -0.3V to (V
CC
 + 0.3V)
DXN_ to GND ........................................... -0.3V to (V
CC
 + 0.3V)
SMBDATA, ALERT, OVERT Current .................. -1mA to +50mA
DXN_ Current .................................................................... Q1mA
Continuous Power Dissipation (T
A
 = +70NC)
TQFN (derate 27.8mW/NC above +70NC) ................... 2222mW
ESD Protection (All Pins, Human Body Model) ...................Q2kV
Operating Temperature Range ........................-40NC to +125NC
Junction Temperature .....................................................+150NC
Storage Temperature Range ..........................-65NC to +150NC
Lead Temperature (soldering, 10s) ...............................+300NC
Soldering Temperature (reflow) ......................................+260NC
ELECTRICAL CHARACTERISTICS
(V
CC
 = +3.0V to +3.6V, T
A
 = -40NC to +125NC,
 
unless otherwise noted. Typical values are at V
CC
 = +3.3V and T
A
 = +25NC.) (Note 2)
ABSOLUTE MAXIMUM RATINGS
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
TQFN
Junction-to-Ambient Thermal Resistance (B
JA
) ......36.0NC/W
Junction-to-Case Thermal Resistance (B
JC
) ..............3.0NC/W
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
Supply Voltage
V
CC
3.0
3.6
V
Standby Supply Current
I
SS
SMBus static
4
15
FA
Operating Current
I
CC1
During conversion, RC off
500
600
FA
I
CC2
During conversion, RC on
550
650
Temperature Resolution
11
Bits
0.125
NC
3-Sigma Temperature Accuracy
(Remote Channels 17)
V
CC
 = 3.3V
T
A
= +30NC to +85NC,
T
RJ
 = +60NC to +100NC
-0.85
+0.85
NC
T
A
, T
RJ
 = -40NC to +125NC
-1.2
+1.2
T
A
= +30NC to +85NC,
T
RJ
 = +100NC to +150NC
-2.5
+2.5
3-Sigma Temperature Accuracy
(Local)
V
CC
 = 3.3V
T
A
 = +30NC to +85NC
-1
+1
NC
T
A
 = -40NC to +125NC
-2
+2
T
A
 = 0NC to +150NC
-3
+3
6-Sigma Temperature Accuracy
(Remote Channels 17)
V
CC
 = 3.3V
T
A
= +30NC to +85NC,
T
RJ
 = +60NC to +100NC
-1
+1
NC
T
A
, T
RJ
 = -40NC to +125NC
-2
+2
T
A
= +30NC to +85NC,
T
RJ
 = +100NC to +125NC
-2.75
+2.75
6-Sigma Temperature Accuracy
(Local)
V
CC
 = 3.3V
T
A
 = +30NC to +85NC
-1.5
+1.5
NC
T
A
 = -40NC to +125NC
-2.5
+2.5
T
A
 = 0NC to +150NC
-3.5
+3.5
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