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參數(shù)資料
| 型號： | MAX5915A |
| 廠商： | Maxim Integrated Products, Inc. |
| 元件分類： | 基準電壓源/電流源 |
| 英文描述： | Dual PCI 2.2 Hot-Swap Controllers |
| 中文描述： | 雙路PCI 2.2熱插拔控制器 |
| 文件頁數(shù)： | 17/25頁 |
| 文件大?。?/td> | 657K |
| 代理商： | MAX5915A |
Maximum Load Capacitance
Large capacitive loads can cause a problem when
inserting discharged PCI cards into the live backplane.
If the time needed to charge the capacitance of the
board is greater than the typical startup time, 50ms, a
fault can occur after startup.
The MAX5915/MAX5916 are able to withstand large
capacitive loads due to their long startup time. Each
supply has its own current-limit threshold. Calculate the
maximum load capacitance as follows:
C
BOARD
< 50ms x I
_, LIM
/ V
SUPPLY
Input Transients
The +12V and +3.3VAUX supplies must be above their
respective UVLO thresholds before startup can occur.
Input transients can cause the input voltage to sag
below the UVLO threshold. The MAX5915/MAX5916
reject input transients that are shorter than t
DEG, UVLO
.
External MOSFET Thermal
Considerations
The power dissipation of the external MOSFET is low
when it is on, P
D
= I
LOAD
2
x R
DS(ON)
. A considerable
amount of power is dissipated during startup and con-
tinuous short-circuit conditions. The design must take
into consideration the worst-case scenario.
Layout Considerations
To take full advantage of the switch response time to an
output fault condition, keep all traces as short as possi-
ble and maximize the high-current trace dimensions to
reduce the effect of undesirable parasitic inductance.
Place the MAX5915/MAX5916 close to the PCI card
’
s
connector. Use a ground plane to minimize impedance
and inductance. Minimize the current-sense resistor
trace length and ensure accurate current sensing with
Kelvin connections (Figure 9).
When an output is short circuited, the voltage drop
across the external MOSFET becomes large. Hence the
power dissipation across the switch and die tempera-
ture both increase. An efficient way to achieve good
power dissipation on a surface-mount package is to lay
out two copper pads directly under the package on
both sides of the board. Connect the two pads to the
ground plane through vias, and use enlarged copper
mounting pads on the topside of the board.
Chip Information
TRANSISTOR COUNT: 1021
PROCESS: BiCMOS
M
Dual PCI 2.2 Hot-Swap Controllers
______________________________________________________________________________________
17
Table 2. Logic Diagram Signal Descriptions
SIGNAL NAME
DESCRIPTION
Enable_+12VIN
Signal is HIGH:
1. +12VIN > V
UVLO, +12V
2. ON_ = HIGH
3. Thermal shutdown NOT active
Startup_+12VIN
Signal is HIGH:
1. +12VIN > V
UVLO, +12V
2. ON_ = HIGH
3. t
START
has elapsed
Enable_3.3VAUXIN
Signal is HIGH
1. 3.3VAUXIN > V
UVLO, AUX
2. AUXON_ = HIGH
3. Thermal shutdown NOT active
Startup_3.3VAUXIN
Signal is HIGH:
1. 3.3VAUXIN > V
UVLO, AUX
2. AUXON_ = HIGH
3. t
START
has elapsed
OC_
Signal is HIGH when an overcurrent condition exists on the output of the supply.
UV_
Signal is HIGH when an undervoltage condition exists on the output of the supply.
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參數(shù)描述 |
|---|---|
| MAX5915AEUI | 功能描述:熱插拔功率分布 RoHS:否 制造商:Texas Instruments 產(chǎn)品:Controllers & Switches 電流限制: 電源電壓-最大:7 V 電源電壓-最小:- 0.3 V 工作溫度范圍: 功率耗散: 安裝風格:SMD/SMT 封裝 / 箱體:MSOP-8 封裝:Tube |
| MAX5915AEUI+ | 功能描述:熱插拔功率分布 Dual PCI 2.2 Hot Swap Controller RoHS:否 制造商:Texas Instruments 產(chǎn)品:Controllers & Switches 電流限制: 電源電壓-最大:7 V 電源電壓-最小:- 0.3 V 工作溫度范圍: 功率耗散: 安裝風格:SMD/SMT 封裝 / 箱體:MSOP-8 封裝:Tube |
| MAX5915AEUI+T | 功能描述:熱插拔功率分布 Dual PCI 2.2 Hot Swap Controller RoHS:否 制造商:Texas Instruments 產(chǎn)品:Controllers & Switches 電流限制: 電源電壓-最大:7 V 電源電壓-最小:- 0.3 V 工作溫度范圍: 功率耗散: 安裝風格:SMD/SMT 封裝 / 箱體:MSOP-8 封裝:Tube |
| MAX5915AEUI-T | 功能描述:熱插拔功率分布 RoHS:否 制造商:Texas Instruments 產(chǎn)品:Controllers & Switches 電流限制: 電源電壓-最大:7 V 電源電壓-最小:- 0.3 V 工作溫度范圍: 功率耗散: 安裝風格:SMD/SMT 封裝 / 箱體:MSOP-8 封裝:Tube |
| MAX5915AUUI+ | 功能描述:熱插拔功率分布 Dual PCI 2.2 Hot Swap Controller RoHS:否 制造商:Texas Instruments 產(chǎn)品:Controllers & Switches 電流限制: 電源電壓-最大:7 V 電源電壓-最小:- 0.3 V 工作溫度范圍: 功率耗散: 安裝風格:SMD/SMT 封裝 / 箱體:MSOP-8 封裝:Tube |
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