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參數(shù)資料
| 型號： | MAX5898EGK+TD |
| 廠商： | Maxim Integrated Products |
| 文件頁數(shù)： | 12/33頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC DAC 16BIT DUAL 500MSPS 68-QFN |
| 產(chǎn)品培訓(xùn)模塊： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 標(biāo)準(zhǔn)包裝： | 2,500 |
| 設(shè)置時間： | 11ns |
| 位數(shù)： | 16 |
| 數(shù)據(jù)接口： | 并聯(lián) |
| 轉(zhuǎn)換器數(shù)目： | 2 |
| 電壓電源： | 模擬和數(shù)字 |
| 功率耗散（最大）： | 831mW |
| 工作溫度： | -40°C ~ 85°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 68-VFQFN 裸露焊盤 |
| 供應(yīng)商設(shè)備封裝： | 68-QFN 裸露焊盤（10x10） |
| 包裝： | 帶卷 (TR) |
| 輸出數(shù)目和類型： | 2 電流，單極 |
| 采樣率（每秒）： | 500M |
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MAX5898
16-Bit, 500Msps, Interpolating and Modulating
Dual DAC with Interleaved LVDS Inputs
2
_______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
(DVDD1.8 = AVDD1.8 = 1.8V, AVCLK = AVDD3.3 = DVDD3.3 = 3.3V, modulator off, 2x interpolation, DATACLK output mode, output is
50
double-terminated, external reference at 1.25V, TA = -40°C to +85°C, unless otherwise noted. Typical values are at TA = +25°C,
unless otherwise noted.) (Note 2)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
DVDD1.8, AVDD1.8 to GND, DACREF ..................-0.3V to +2.16V
AVDD3.3, AVCLK, DVDD3.3 to GND, DACREF ........-0.3V to +3.9V
DATACLKP, DATACLKN, D0P–D15P,
D0N–D15N, SELIQP, SELIQN to GND,
DACREF ..........................................-0.3V to (DVDD1.8 + 0.3V)
CS, RESET, SCLK, DIN, DOUT to
GND, DACREF ................................-0.3V to (DVDD3.3 + 0.3V)
CLKP, CLKN to GND, DACREF..............-0.3V to (AVCLK + 0.3V)
REFIO, FSADJ to GND, DACREF ........-0.3V to (AVDD3.3 + 0.3V)
OUTIP, OUTIN, OUTQP,
OUTQN to GND, DACREF ..................-1V to (AVDD3.3 + 0.3V)
DOUT, DATACLKP, DATACLKN Continuous Current ..........8mA
Continuous Power Dissipation (TA = +70°C)
68-Pin QFN (derate 41.7mW/°C above +70°C)
(Note 1) ...................................................................3333.3mW
Junction Temperature ......................................................+150°C
Operating Temperature Range ...........................-40°C to +85°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
STATIC PERFORMANCE
Resolution
16
Bits
Differential Nonlinearity
DNL
±1
LSB
Integral Nonlinearity
INL
±3
LSB
Offset Error
OS
-0.02
±0.003
+0.02
%FS
Offset Drift
±0.03
ppm/°C
Gain Error
GEFS
(Note 3)
-4
±0.06
+4
%FS
Gain-Error Drift
±110
ppm/°C
Full-Scale Output Current
IOUTFS
(Note 3)
2
20
mA
Output Compliance
-0.5
+1.1
V
Output Resistance
ROUT
1M
Output Capacitance
COUT
5pF
DYNAMIC PERFORMANCE
Maximum Clock Frequency
fCLK
500
MHz
Minimum Clock Frequency
fCLK
10
MHz
Maximum DAC Update Rate
fDAC
fDAC = fCLK or fDAC = fCLK / 2
500
Msps
Minimum DAC Update Rate
fDAC
fDAC = fCLK or fDAC = fCLK / 2
10
Msps
Maximum Data Clock Frequency
fDATACLK
Interleaved data
250
MHz
Maximum Input Data Rate
fDATA
Per channel
125
MWps
No interpolation
-156
2x interpolation
-157
fDATA = 125Mwps,
fOUT = 16MHz, fOFFSET
= 10MHz, -12dBFS
4x interpolation
-157
Noise Spectral Density
fDATA = 125Mwps,
fOUT = 16MHz, fOFFSET
= 10MHz, 0dBFS
4x interpolation
-154
dBFS/
Hz
Note 1: Thermal resistance based on a multilayer board with 4 x 4 via array in exposed paddle area.
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