M
32-Channel, 16-Bit, Voltage-Output
DACs with Serial Interface
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25
Selector Guide
PART
INL (MAX LSB)
OUTPUT VOLTAGE
RANGE (V)
MAX5732ACTN
MAX5732BCTN
MAX5732CCTN
MAX5732AETN
MAX5732BETN
MAX5732CETN
MAX5733ACTN
MAX5733BCTN
MAX5733CCTN
MAX5733AETN
MAX5733BETN
MAX5733CETN
MAX5734ACTN
MAX5734BCTN
MAX5734CCTN
MAX5734AETN
MAX5734BETN
MAX5734CETN
MAX5735ACTN
MAX5735BCTN
MAX5735CCTN
MAX5735AETN
MAX5735BETN
MAX5735CETN
±8
±16
±64
±8
±16
±64
±8
±16
±64
±8
±16
±64
±8
±16
±64
±8
±16
±64
±8
±16
±64
±8
±16
±64
0 to +5
0 to +5
0 to +5
0 to +5
0 to +5
0 to +5
0 to +10
0 to +10
0 to +10
0 to +10
0 to +10
0 to +10
-2.5 to +7.5
-2.5 to +7.5
-2.5 to +7.5
-2.5 to +7.5
-2.5 to +7.5
-2.5 to +7.5
-5 to +5
-5 to +5
-5 to +5
-5 to +5
-5 to +5
-5 to +5
Pin Configuration
TOP VIEW
MAX5732
MAX5733
MAX5734
MAX5735
V
SS
OUT2
OUT3
AGND
OUT4
OUT5
OUT6
OUT0
OUT1
N.C.
OUT7
OUT8
OUT9
AV
CC
11
10
9
8
7
6
5
4
3
2
14
13
12
1
EXPOSED PADDLE
C
8mm x 8mm THIN QFN-EP
D
S
D
D
D
D
L
D
G
C
R
R
V
S
A
D
20
19
18
17
16
24
23
22
21
15
26
25
28
27
29
30
31
32
33
34
35
36
37
38
AGND
OUT23
OUT24
OUT25
OUT26
OUT27
OUT28
OUT29
OUT30
OUT31
39
V
SS
40
41
OUT21
OUT22
42
AV
CC
46
47
48
49
50
43
44
45
51
O
A
D
R
A
C
O
O
O
O
52
O
53
54
55
O
O
O
56
O
Chip Information
TRANSISTOR COUNT: 152,000
PROCESS: BiCMOS
breakdown voltages. Some devices require external
protection on their reference inputs to satisfy absolute
maximum ratings. The MAX5734 features outputs that
are almost rail-to-rail. This allows the AV
CC
and V
SS
supplies to be set to voltages within the absolute maxi-
mum ratings of the PEIC. This guarantees that the PEIC
is protected in all situations.
Additional protection is provided by the MAX5734
glitch-free power-up into the clear state with all DAC
outputs set to approximately 0V. Either the serial port or
the
CLR
input can assert the clear function.
Power Supplies, Bypassing,
Decoupling, and Layout
Grounding and power-supply decoupling strongly influ-
ence device performance. Digital signals can couple
through the reference input, power supplies, and ground
connection. Proper grounding and layout can reduce
digital feedthrough and crosstalk. Bypass all power sup-
plies with an additional 0.1μF and 1μF on each pin, as
close to the device as possible. Refer to the MAX5732–
MAX5735 evaluation kit for a suggested layout.
The MAX5732–MAX5735 have four separate power
supplies. AV
DD
powers the internal analog circuitry
(except for the output buffers) and DV
DD
powers the
digital section of the device. AV
CC
and V
SS
power the
output buffers.
The MAX5732–MAX5735 feature an exposed paddle on
the backside of the package for improved power dissi-
pation. The exposed paddle is electrically connected to
V
SS
, and should be soldered to a large copper plane
that shares the same potential. For more information on
the exposed paddle QFN package, refer to the following
website: http://pdfserv.maxim-ic.com/arpdf/AppNotes/
4hfan081.pdf