參數(shù)資料
型號: MAX3967ETG
廠商: MAXIM INTEGRATED PRODUCTS INC
元件分類: 其它接口
英文描述: 270Mbps SFP LED Driver
中文描述: SPECIALTY INTERFACE CIRCUIT, QCC24
封裝: 4 X 4 MM, 0.80 MM HEIGHT, QFN-24
文件頁數(shù): 9/14頁
文件大小: 319K
代理商: MAX3967ETG
Applic ations Information
Wire-Bonding Die
The MAX3967 utilizes gold metalization, which provides
high reliability. Make connections to the die with gold
wire only, using ball-bonding techniques. Use caution if
attempting wedge-bonding. Pad size is 4 mils x 4 mils
(100μm). Die thickness is typically 15 mils (375μm).
Exposed-Pad Pac kage
The exposed pad on the 24-pin QFN provides a very
low thermal resistance path for heat removal from
the IC.
Chip Information
TRANSISTOR COUNT: 327
SUBSTRATE CONNECTED TO V
EE
PROCESS: BIPOLAR
DIE THICKNESS: 15 mils
M
270Mbps S FP LED Driver
_______________________________________________________________________________________
9
Input T erminations
PECL
OUTPUT
IN+
V
CC
V
CC
V
CC
- 2
V
50
3.3
82
130
R1
R2
5.0
68
180
R1
R2
RF OR NON-PECL
OUTPUT
IN+
SINGLE-ENDED TERMINATION IS SHOWN. IN- SHOULD BE TERMINATED SIMILARLY.
MAX3967
MAX3967
Figure 3. Input Terminations
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