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參數(shù)資料
| 型號(hào)： | MAX3751CEE |
| 廠商： | MAXIM INTEGRATED PRODUCTS INC |
| 元件分類： | 通信及網(wǎng)絡(luò) |
| 英文描述： | +3.3V, 2.125Gbps/1.0625Gbps Fibre Channel Port Bypass ICs |
| 中文描述： | SPECIALTY TELECOM CIRCUIT, PDSO16 |
| 封裝： | 0.150 INCH, 0.025 INCH PITCH, MO-137, QSOP-16 |
| 文件頁數(shù)： | 4/6頁 |
| 文件大小： | 157K |
| 代理商： | MAX3751CEE |
M
+3.3V, 2.125Gbps/1.0625Gbps
Fibre Channel Port Bypass ICs
4
_______________________________________________________________________________________
_________________Circuit Description
A simplified block diagram of the single port bypass is
shown in Figure 1. IN+ and IN- drive an input buffer
(INBUFF) with 150
of internal differential input termi-
nation. INBUFF drives an output buffer (LOBUFF) and
an input to a multiplexer (MUX).
A low TTL input at SEL selects the signal path of
INBUFF through MUX to the output buffer (OUTBUFF).
When SEL has a high TTL logic level present the signal
path is into LIBUFF, through MUX, to OUTBUFF.
Low-Frequency Cutoff
The low-frequency cutoff is determined by the input
resistance and the coupling capacitor as illustrated by
the following equation:
f
C
= 1 / (2
π
RC)
In a typical system where R = 150
and C = 100nF,
resulting in f
C
= 10kHz.
Layout Techniques
The MAX3750/MAX3751 are high-frequency products.
The performance of the circuit is largely dependent
upon layout of the circuit board. Use a multilayer circuit
board with dedicated ground and V
CC
planes. Power
supplies should be capacitively bypassed to the
ground plane with surface-mount capacitors placed
near the power-supply pins.
SEL
NOTE: SEE INTERNAL INPUT/OUTPUT SCHEMATICS FOR DETAILED TERMINATIONS (FIGURES 2–5).
INBUFF
LOBUFF
LIBUFF
IN+
IN-
MUX
D0
Q
SEL
TTLIN
D1
OUTBUFF
OUT+
OUT-
V
CC
GND
L
L
L
L
MAX3750
MAX3751
Figure 1. MAX3750/MAX3751 Block Diagram
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| MAX3750CEE | +3.3V, 2.125Gbps/1.0625Gbps Fibre Channel Port Bypass ICs |
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| MAX3831UCB | +3.3V, 2.5Gbps, SDH/SONET, 4-Channel Interconnect Mux/Demux ICs with Clock Generator |
| MAX3832UCB | Dual LVDS Transmitter/Receiver 16-SOIC -40 to 85 |
| MAX3841 | Dual LVDS Transmitter/Receiver 16-TSSOP -40 to 85 |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MAX3752CCM | 功能描述:通信集成電路 - 若干 RoHS:否 制造商:Maxim Integrated 類型:Transport Devices 封裝 / 箱體:TECSBGA-256 數(shù)據(jù)速率:100 Mbps 電源電壓-最大:1.89 V, 3.465 V 電源電壓-最小:1.71 V, 3.135 V 電源電流:50 mA, 225 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝:Tube |
| MAX3752CCM+ | 制造商:Rochester Electronics LLC 功能描述: 制造商:Maxim Integrated Products 功能描述: |
| MAX3752CCM-D | 功能描述:通信集成電路 - 若干 RoHS:否 制造商:Maxim Integrated 類型:Transport Devices 封裝 / 箱體:TECSBGA-256 數(shù)據(jù)速率:100 Mbps 電源電壓-最大:1.89 V, 3.465 V 電源電壓-最小:1.71 V, 3.135 V 電源電流:50 mA, 225 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝:Tube |
| MAX3752CCM-T | 功能描述:通信集成電路 - 若干 RoHS:否 制造商:Maxim Integrated 類型:Transport Devices 封裝 / 箱體:TECSBGA-256 數(shù)據(jù)速率:100 Mbps 電源電壓-最大:1.89 V, 3.465 V 電源電壓-最小:1.71 V, 3.135 V 電源電流:50 mA, 225 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝:Tube |
| MAX3752CCM-TD | 功能描述:通信集成電路 - 若干 RoHS:否 制造商:Maxim Integrated 類型:Transport Devices 封裝 / 箱體:TECSBGA-256 數(shù)據(jù)速率:100 Mbps 電源電壓-最大:1.89 V, 3.465 V 電源電壓-最小:1.71 V, 3.135 V 電源電流:50 mA, 225 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝:Tube |
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