參數(shù)資料
型號(hào): MAX3735ETG
廠商: MAXIM INTEGRATED PRODUCTS INC
元件分類(lèi): 其它接口
英文描述: 2.7Gbps, Low-Power SFP Laser Drivers
中文描述: SPECIALTY INTERFACE CIRCUIT, QCC24
封裝: 4 X 4 MM, 0.80 MM HEIGHT, MO-220WGGD-2, TQFN-24
文件頁(yè)數(shù): 2/18頁(yè)
文件大?。?/td> 1734K
代理商: MAX3735ETG
M
2.7Gbps, Low-Power SFP Laser Drivers
2
_______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
Supply Voltage, V
CC
..............................................-0.5V to +6.0V
Current into BIAS, OUT+, OUT-......................-20mA to +150mA
Current into MD.....................................................-5mA to +5mA
Voltage at IN+, IN-, TX_DISABLE, TX_FAULT,
SHUTDOWN...........................................-0.5V to (V
CC
+ 0.5V)
Voltage at BIAS, PC_MON, BC_MON,
MODSET, APCSET.................................-0.5V to (V
CC
+ 0.5V)
Voltage at OUT+, OUT-.............................+0.5V to (V
CC
+ 1.5V)
Voltage at APCFILT1, APCFILT2..............................-0.5V to +3V
ELECTRICAL CHARACTERISTICS
(V
CC
= +2.97V to +3.63V, T
A
= -40
°
C to +85
°
C. Typical values at V
CC
= +3.3V, I
BIAS
= 20mA, I
MOD
= 30mA, T
A
= +25
°
C, unless
otherwise noted.) (Note 1)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
Continuous Power Dissipation (T
A
= +85
°
C )
24-Lead Thin QFN (derate 20.8mW/
°
C
above +85
°
C).............................................................1354mW
24-Lead QFN (derate 20.8mW/
°
C
above +85
°
C).............................................................1354mW
Operating Ambient Temperature Range (T
A
)......-40
°
C to +85
°
C
Storage Ambient Temperature Range...............-55
°
C to +150
°
C
Die Attach Temperature...................................................+400
°
C
Lead Temperature (soldering, 10s).................................+300
°
C
PARAMETER
SYM B O L
CONDITIONS
MIN
TYP
MAX
UNITS
POWER SUPPLY
Power-Supply Current
I
CC
Excludes the laser bias and modulation
currents (Note 2)
27
50
mA
I/O SPECIFICATIONS
Differential Input Voltage
Common-Mode Input Voltage
Differential Input Resistance
V
ID
V
ID
= (V
IN
+) - (V
IN
-), Figure 1
200
2400
mV
P-P
V
0.6
×
V
CC
100
85
115
TX_DISABLE Input Pullup
Resistance
R
PULL
4.7
7.4
10.0
k
V
HIGH
= V
CC
V
LOW
= GND, V
CC
= 3.3V, R
PULL
= 7.4k
15
TX_DISABLE Input Current
-450
μA
TX_DISABLE Input High Voltage
TX_DISABLE Input Low Voltage
TX_FAULT Output High Voltage
TX_FAULT Output Low Voltage
SHUTDOWN Output High Voltage
SHUTDOWN Output Low Voltage
BIAS GENERATOR
Bias On-Current Range
V
IH
V
IL
V
OH
V
OL
V
OH
V
OL
2
V
V
V
V
V
V
0.8
I
OH
= 100μA sourcing (Note 3)
I
OL
= 1mA sinking (Note 3)
I
OH
= 100μA sourcing
I
OL
= 100μA sinking
2.4
0.4
V
CC
- 0.4
0.4
I
BIAS
Current into BIAS pin
1
100
mA
Bias Off-Current
I
BIASOFF
Current into BIAS pin during TX_FAULT or
TX_DISABLE
100
μA
Bias Overshoot
During SFP module hot plugging
(Notes 4, 5, 11)
10
%
External resistor to GND defines the voltage
gain, I
BIAS
= 1mA, R
BC_MON
= 69.28k
I
BIAS
= 100mA, R
BC_MON
= 693.25
1mA
I
BIAS
100mA
(Notes 4, 6)
10.0
12
13.5
Bias-Current Monitor Gain
I
BC_MON
11.5
-8
-6
13
13.5
+8
+6
mA/A
MAX3735
MAX3735A
Bias-Current Monitor Gain
Stability
%
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