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參數(shù)資料
| 型號： | MAX3340EEUD |
| 廠商： | MAXIM INTEGRATED PRODUCTS INC |
| 元件分類： | 其它接口 |
| 英文描述： | TRANSLATOR| OTHER/SPECIAL/MISCELLANEOUS|TSSOP|14PIN|PLASTIC |
| 中文描述： | SPECIALTY INTERFACE CIRCUIT, PDSO14 |
| 封裝： | 4.40 MM, TSSOP-14 |
| 文件頁數(shù)： | 13/17頁 |
| 文件大?。?/td> | 389K |
| 代理商： | MAX3340EEUD |
M
±15kV ESD-Protected USB Transceiver
in UCSP
___________________________________________________________________________________________________
13
13
IEC 1000-4-2
The IEC 1000-4-2 standard covers ESD testing and
performance of finished equipment; it does not specifi-
cally refer to integrated circuits. The MAX3346E helps
to design equipment that meets Level 2 of IEC 1000-4-
2, without the need for additional ESD-protection com-
ponents.
The major difference between tests done using the
Human Body Model and IEC 1000-4-2 is a higher peak
current in IEC 1000-4-2, because series resistance is
lower in the IEC 1000-4-2 model. Hence, the ESD with-
stand voltage measured to IEC 1000-4-2 is generally
lower than that measured using the Human Body Model.
Figure 7a shows the IEC 1000-4-2 model.
The Air-Gap Discharge test involves approaching the
device with a charged probe. The Contact Discharge
method connects the probe to the device before the
probe is energized.
Machine Model
The Machine Model for ESD tests all pins using a 200pF
storage capacitor and zero discharge resistance. Its
objective is to emulate the stress caused by contact that
occurs with handling and assembly during manufactur-
ing. Of course, all pins require this protection during
manufacturing, not just USB inputs and outputs.
Therefore, after PC board assembly, the Machine Model
is less relevant to I/O ports.
UCSP Applications Information
For the latest application details on UCSP construction,
dimensions, tape carrier information, printed circuit board
techniques, bump-pad layout, and recommended reflow
temperature profile as well as the latest information on
reliability testing results, go to the Maxim website at
www.maxim-ic.com/ucsp for the Application Note,
“UCSP—A Wafer-Level Chip-Scale Package.”
CHARGE-CURRENT
LIMIT RESISTOR
DISCHARGE
RESISTANCE
STORAGE
CAPACITOR
Cs
150pF
R
C
50M
to 100M
R
D
330
HIGH-
VOLTAGE
DC
SOURCE
DEVICE
UNDER
TEST
Figure 7a. IEC 1000-4-2 ESD Test Model
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MAX3341EEBE | 制造商:Maxim Integrated Products 功能描述:+/-15KV ESD-PROTECTED USB LEVEL TRA - Rail/Tube 制造商:Rochester Electronics LLC 功能描述: |
| MAX3341EEUE | 制造商:Maxim Integrated Products 功能描述:+/-15KV ESD-PROTECTED USB LEVEL TRANSLATOR IN - Rail/Tube 制造商:Rochester Electronics LLC 功能描述: |
| MAX3342EEBE | 制造商:Maxim Integrated Products 功能描述:+/-15KV ESD-PROTECTED USB TRANSCEIV - Rail/Tube 制造商:Rochester Electronics LLC 功能描述: |
| MAX3342EEBE-T | 制造商:Rochester Electronics LLC 功能描述: 制造商:Maxim Integrated Products 功能描述: |
| MAX3343EEBE | 制造商:Maxim Integrated Products 功能描述:+/-15KV ESD-PROTECTED USB LEVEL TRA - Rail/Tube |
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