參數(shù)資料
型號(hào): MAX3267CSA
廠商: MAXIM INTEGRATED PRODUCTS INC
元件分類: 通信及網(wǎng)絡(luò)
英文描述: 1.25Gbps/2.5Gbps, 3V to 5.5V, Low-Noise Transimpedance Preamplifiers for LANs
中文描述: SPECIALTY TELECOM CIRCUIT, PDSO8
封裝: 0.150 INCH, SOIC-8
文件頁(yè)數(shù): 2/8頁(yè)
文件大?。?/td> 152K
代理商: MAX3267CSA
ps
ps
M
1.25Gbps/2.5Gbps, 3V to 5.5V, Low-Noise
Transimpedanc e Preamplifiers for LANs
2
_______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
Supply Voltage (V
CC
- GND).................................-0.5V to +6.0V
IN Current..............................................................-4mA to +4mA
FILTER Current......................................................-8mA to +8mA
Voltage at OUT+, OUT- ...................(V
CC
- 1.5V) to (V
CC
+ 0.5V)
Continuous Power Dissipation (T
A
= +70°C)
SO package (derate 6.7mW/°C above +70°C).............533mW
ELECTRICAL CHARACTERISTICS
(V
CC
= +3.0V to +5.5V, T
A
= 0°C to +70°C, 100
load between OUT+ and OUT-. Typical values are at T
A
= +25°C, V
CC
= 3.3V,
source capacitance = 0.85pF, unless otherwise noted.) (Note 1)
PARAMETER
Input Bias Voltage
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
Storage Temperature Range.............................-55°C to +150°C
Operating J unction Temperature (die)..............-55°C to +150°C
Processing Temperature (die) .........................................+400°C
Lead Temperature (soldering, 10sec) .............................+300°C
MAX3267
MAX3266
MAX3267
MAX3266
MAX3267
-3dB, input
20μADC
MAX3266
MAX3267
MAX3266
MAX3267
MAX3266
MAX3266
MAX3267
MAX3266
Power-Supply Rejection Ratio
(PSRR)
50
dB
Output referred, f < 2MHz
PSRR = -20log (
V
OUT
/
V
CC
)
19
12
76
50
Transimpedance Linear Range
40
μAp-p
30
Low-Frequency Cutoff
44
kHz
750
1530
920
1900
1100
2420
Small-Signal Bandwidth
MHz
Peak-to-peak
0.95 < linearity < 1.05
6.6
11.0
Input-Referred RMS Noise
485
655
nA
200
DC Input Overload
AC Input Overload
1.0
0.65
mAp-p
mA
192
256
SO package
(Note 2)
Die, packaged in TO-56
header (Note 2)
MIN
0.69
TYP
0.83
26
MAX
0.91
50
UNITS
V
mA
Filter Resistor
1220
1500
1860
Output Impedance
Maximum Differential Output
Voltage
48
50
52
Transimpedance
1540
1900
2330
Supply Current
2260
2800
3400
CONDITIONS
Single-ended (per side)
Differential, measured
with 30μAp-p signal
(40μAp-p for MAX3267)
Note 1:
Source Capacitance represents the total capacitance at the IN pin during characterization of noise and bandwidth parame-
ters. Figure 1 shows the typical source capacitance vs. reverse voltage for the photodiode used during characterization of
TO-56 header packages. Noise and bandwidth will be affected by the source capacitance. See the Typical Operating
Characteristics for more information.
Note 2:
Input-Referred Noise is calculated as RMS Output Noise / (Gain at f = 10MHz). Noise Density is (Input-Referred Noise) /
bandwidth
. No external filters are used for the noise measurements.
Note 3:
Deterministic J itter is measured with the K28.5 pattern applied to the input [00111110101100000101].
185
250
415
mVp-p
Input = 1mAp-p
Input-Referred Noise Density
pA/(Hz)
1/2
(Note 2)
Deterministic J itter
(Note 3)
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