參數(shù)資料
型號: MAX3229
廠商: Maxim Integrated Products, Inc.
英文描述: +2.5V to +5.5V RS-232 Transceivers in UCSP
中文描述: +2.5V至+5.5V、RS-232收發(fā)器,UCSP封裝
文件頁數(shù): 11/14頁
文件大?。?/td> 238K
代理商: MAX3229
UCSP Reliability
The UCSP represents a unique packaging form factor
that may not perform equally to a packaged product
through traditional mechanical reliability tests. CSP relia-
bility is integrally linked to the user
s assembly methods,
circuit board material, and usage environment. The user
should closely review these areas when considering use
of a CSP package. Performance through Operating Life
Test and Moisture Resistance remains uncompromised
as it is primarily determined by the wafer-fabrication
process.
Mechanical stress performance is a greater considera-
tion for a CSP package. CSPs are attached through
direct solder contact to the user
s PC board, foregoing
the inherent stress relief of a packaged product lead
frame. Solder joint contact integrity must be consid-
ered. Table 5 shows the testing done to characterize
the CSP reliability performance. In conclusion, the
UCSP is capable of performing reliably through envi-
ronmental stresses as indicated by the results in the
table. Additional usage data and recommendations are
detailed in the UCSP application note, which can be
found on Maxim
s website at www.maxim-ic.com.
Chip Information
TRANSISTOR COUNT: 698
PROCESS TECHNOLOGY: CMOS
M
+2.5V to +5.5V RS-232 Transceivers
in UCSP
______________________________________________________________________________________
11
V
L
MAX3229
5k
R1IN
R1OUT
TTL/CMOS
C2-
T1IN
C2+
C1-
C1+
A1
A5
C1
D1
A2
A3
A6
C6
B1
A4
E3
E5
E2
20
μ
A
20
μ
A
E1
C5
B5
V-
V+
V
CC
2.5V TO 5.5V
C4
0.1
μ
F
C3
0.1
μ
F
C1
0.1
μ
F
C
BYPASS
C2
0.1
μ
F
0.1
μ
F
0.1
μ
F
FORCEOFF
FORCEON
INVALID
T1OUT
GND
V
L
TO POWER-
MANAGEMENT
UNIT
RS-232
V
L
V
L
V
L
1.65V TO 5.5V
V
L
Typical Operating Circuits
(continued)
TEST
CONDITIONS
DURATION
NO. OF FAILURES PER
SAMPLE SIZE
Temperature Cycle
-35
°
C to +85
°
C,
-40
°
C to +100
°
C
T
A
= +70
°
C
+20
°
C to +60
°
C, 90% RH
-20
°
C
150 cycles,
900 cycles
0/10,
0/200
Operating Life
Moisture Resistance
Low-Temperature Storage
240hr
240hr
240hr
0/10
0/10
0/10
Low-Temperature Operational
-10
°
C
24hr
0/10
Solderability
ESD
High-Temperature Operating
Life
8hr steam age
±
2000V, Human Body Model
0/15
0/5
T
J
= +150
°
C
168hr
0/45
Table 5. Reliability Test Data
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