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參數(shù)資料
| 型號(hào)： | MAX2170EVKIT |
| 廠商： | Maxim Integrated Products, Inc. |
| 英文描述： | Evaluation Kit |
| 中文描述： | MAX2170評(píng)估板 |
| 文件頁數(shù)： | 4/8頁 |
| 文件大?。?/td> | 455K |
| 代理商： | MAX2170EVKIT |
E
Note the 6dB loss at the output ports of the EV kit
due to the 50
resistor in series at the buffer out-
puts and the 50
load of the test equipment.
Gain Control
The RF and baseband VGA circuits of the MAX2170
are controlled independently through jumpers JP10
and JP4, respectively. Connecting pins 2-3 of JP10
closes the RF gain control loop. The MAX2170 EV kit
also implements a control loop for the baseband VGA
through shorting pins 1-2 of JP4. The HOLD_AGC con-
trols the MAX4729 analog switch (see Figure 1 for
schematic details). In typical applications, the demodu-
lator controls the baseband VGA. The analog switch
and the external AGC circuitry (Q1, Q2, and Q3) are
optional components and only needed when the
demodulator lacks a baseband AGC control circuit.
Layout Issues
A good PCB is an essential part of an RF circuit design.
The EV kit PCB serves as a guide for laying out a board
using the MAX2170. Keep traces carrying RF signals
as short as possible to minimize radiation and insertion
loss. Use impedance control on all RF signal traces.
The exposed paddle must be soldered evenly to the
board’s ground plane for proper operation. Use abun-
dant vias beneath the exposed paddle and between RF
traces to minimize undesired RF coupling.
To minimize coupling between different sections of the
IC, each V
CC
pin must have a bypass capacitor with low
impedance to the closest ground at the frequency of
interest. Do not share ground vias among multiple con-
nections to the PCB ground plane. Refer to the Layout
section of the MAX2170 data sheet for more information.
MAX2170 Evaluation Kit
4
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