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參數(shù)資料
| 型號： | MAX2047ETJ-T |
| 廠商： | MAXIM INTEGRATED PRODUCTS INC |
| 元件分類： | 無繩電話/電話 |
| 英文描述： | High-Gain Vector Multipliers |
| 中文描述： | TELECOM, CELLULAR, BASEBAND CIRCUIT, QCC32 |
| 封裝： | 5 X 5 MM, 0.80 MM HEIGHT, TQFN-32 |
| 文件頁數(shù)： | 20/22頁 |
| 文件大?。?/td> | 999K |
| 代理商： | MAX2047ETJ-T |
M
On-Chip Reference Voltage
An on-chip, 2.5V reference voltage is provided for
single-ended control mode. Connect REFOUT to VI2
and VQ2 to provide a stable reference voltage. The
equivalent output resistance of the REFOUT pin is
approximately 80
. REFOUT is capable of sourcing
1mA of current, with <10mV drop-in voltage.
Applications Information
RF Single-Ended Operation
The RF input impedance is 50
differential into the IC.
An external low-loss 1:1 balun can be used for single-
ended operation. The RF output impedance is 300
differential into the IC. An external low-loss 4:1 balun
transforms this impedance down to 50
single-ended
output (Figures 1 and 2).
Bias Resistor
The bias resistor value (280
) was optimized during
characterization at the factory. This value should not be
adjusted. If the 280
(±1%) resistor is not readily avail-
able, substitute a standard 280
(±5%) resistor, which
may result in more current part-to-part variation.
Switching Speed
The control inputs have a typical 3dB BW of 260MHz.
This BW provides the device with the ability to adjust
gain/phase at a very rapid rate. The Switching Speed
graphs in the
Typical Operating Characteristics
try to
capture the control ability of the vector multipliers.
These measurements were done by first removing
capacitors C4
–
C7 to reduce driving capacitance.
The test for gathering the curves shown, uses a
MAX9602 differential output comparator to drive VI1,
VI2, VQ1, and VQ2. One output of the comparator is
connected to VI1/VQ1, while the other is connected to
VI2/VQ2. The input to the vector multiplier is driven by
an RF source and the output is connected to a crystal
detector. The switching signal produces a waveform
that results in a ±0.7V differential input signal to the
vector multiplier.
This signal switches the signal from quadrant 3 (-0.7V
case), through the origin (maximum attenuation), and
into quadrant 1 (+0.7V case). The before-and-after
amplitude (S21) stays about the same between the two
quadrants but the phase changes by 180
°
.
As the differential control signal approaches zero, the
gain approaches its minimum value. This appears as
the null in the
Typical Operating Characteristics
. The
measurement results include rise-time errors from the
crystal detector (specified by manufacturing to be
approximately 8ns to 12ns), the comparator (approxi-
mately 500ps), and the 500MHz BW oscilloscope (used
to measure the control and detector signals).
Layout Issues
A properly designed PC board is an essential part of
any RF/microwave circuit. Keep RF signal lines as short
as possible to reduce losses, radiation, and inductance.
For best performance, route the ground pin traces
directly to the exposed pad underneath the package.
This pad should be connected to the ground plane of
the board by using multiple vias under the device to
provide the best RF/thermal conduction path. Solder the
exposed pad on the bottom of the device package to a
PC board exposed pad.
The
MAX2045/MAX2046/MAX2047 Evaluation Kit
can
be used as a reference for board layout. Gerber files
are available upon request at www.maxim-ic.com.
Power-Supply Bypassing
Proper voltage-supply bypassing is essential for high-
frequency circuit stability. Bypass the V
CC
pins with
10nF and 22pF (47pF for the MAX2047) capacitors.
Connect the high-frequency capacitor as close to the
device as possible.
Exposed Paddle RF Thermal
Considerations
The EP of the 32-lead thin QFN package provides a low
thermal-resistance path to the die. It is important that the
PC board on which the IC is mounted be designed to
conduct heat from this contact. In addition, the EP
provides a low-inductance RF ground path for the device.
It is recommended that the EP be soldered to a ground
plane on the PC board, either directly or through an
array of plated via holes.
Soldering the pad to ground is also critical for proper heat
dissipation. Use a solid ground plane wherever possible.
Chip Information
TRANSISTOR COUNT: 599
High-Gain Vector Multipliers
20
______________________________________________________________________________________
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