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參數(shù)資料
| 型號(hào)： | MAX1779 |
| 廠商： | Maxim Integrated Products, Inc. |
| 英文描述： | 32-Bit Digital Signal Controller with ROM 100-LQFP -40 to 125 |
| 中文描述： | 低功耗、三輸出TFT LCD DC-DC轉(zhuǎn)換器 |
| 文件頁(yè)數(shù)： | 14/18頁(yè) |
| 文件大小： | 503K |
| 代理商： | MAX1779 |
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M
Low-Power Triple-Output TFT LCD DC-DC
Converter
14
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nated by the internal switch resistance and the diode
impedance. Start with 0.1μF ceramic capacitors.
Smaller values may be used for low-current applica-
tions.
Charge-Pump Output Capacitor
Increasing the output capacitance or decreasing the
ESR reduces the output ripple voltage and the peak-to-
peak transient voltage. Use the following equation to
approximate the required capacitor value:
C
PUMP
≥
[I
PUMP
/ (125kHz
V
RIPPLE
)]
Charge-Pump Input Capacitor
Use a bypass capacitor with a value equal to or greater
than the flying capacitor. Place the capacitor as close
to the IC as possible. Connect directly to PGND.
Rectifier Diode
Use Schottky diodes with a current rating equal to or
greater than 4 times the average output current, and a
voltage rating at least 1.5 times V
SUPP
for the positive
charge pump and V
SUPN
for the negative charge pump.
PC Board Layout and Grounding
Carefully printed circuit layout is extremely important to
minimize ground bounce and noise. First, place the
main boost converter output diode and output capacitor
less than 0.2in (5mm) from the LX and PGND pins with
wide traces and no vias. Then place 0.1μF ceramic
bypass capacitors near the charge-pump input pins
(SUPP and SUPN) to the PGND pin. Keep the charge-
pump circuitry as close to the IC as possible, using
wide traces and avoiding vias when possible. Locate
all feedback resistive dividers as close to their respec-
tive feedback pins as possible. The PC board should
feature separate GND and PGND areas connected at
only one point under the IC. To maximize output power
and efficiency and to minimize output power ripple volt-
age, use extra wide power ground traces and solder
the IC
’
s power ground pin directly to it. Avoid having
sensitive traces near the switching nodes and high-cur-
rent lines.
Refer to the MAX1779 evaluation kit for an example of
proper board layout.
Applications Information
LX Charge Pump
Some applications require multiple charge-pump
stages due to low supply voltages. In order to reduce
the circuit
’
s size and component count, an unregulated
charge pump may be added onto the LX switching
node. The configuration shown in Figure 4 works well
for most applications. The maximum output current of
the low-power charge pumps depends on the maxi-
mum load current that the LX charge pump can provide
and is limited by the following formula:
I
LXPUMP
= ((N + 1)
I
POS
) + (M + I
NEG
)
≤
5mA
where N is the number of stages in the positive low-
power charge pump, and M is the number of stages in
the negative charge pump. Applications requiring more
output current should not use the LX charge pump, so
they will require extra stages on both low-power charge
pumps. The output capacitor of this unregulated
charge pump needs to be stacked on top of the main
output in order to keep the main regulator stable.
Increasing the integrator capacitor may also be
required to compensate for the additional charge-pump
capacitance on the main regulator loop.
The output capacitor of this unregulated charge pump
needs to be stacked on top of the main output in order
to keep the main regulator stable. Increasing the inte-
grator capacitor may also be required to compensate
for the additional charge-pump capacitance on the
main regulator loop.
Chip Information
TRANSISTOR COUNT: 2846
SUPPLIER
INDUCTORS
Coilcraft
Coiltronics
Sumida USA
Toko
CAPACITORS
AVX
Kemet
Sanyo
Taiyo Yuden
DIODES
PHONE
FAX
847-639-6400
561-241-7876
847-956-0666
847-297-0070
847-639-1469
561-241-9339
847-956-0702
847-699-1194
803-946-0690
408-986-0424
619-661-6835
408-573-4150
803-626-3123
408-986-1442
619-661-1055
408-573-4159
Central
Semiconductor
516-435-1110
516-435-1824
International
Rectifier
310-322-3331
310-322-3332
Motorola
Nihon
Zetex
602-303-5454
847-843-7500
516-543-7100
602-994-6430
847-843-2798
516-864-7630
Table 1. Component Suppliers
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| MAX1779EUE | 32-Bit Digital Signal Controller with ROM 100-LQFP -40 to 125 |
| MAX177CNG | 32-Bit Digital Signal Controller with ROM 100-BGA MICROSTAR -40 to 85 |
| MAX177EWG | CMOS 10-Bit A/D Converter with Track-and-Hold |
| MAX177MRG | RECTIFIER 6A 600V R-6 |
| MAX177CWG | 32-Bit Digital Signal Controller with ROM 100-BGA MICROSTAR -40 to 85 |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MAX1779EUE | 功能描述:直流/直流開關(guān)轉(zhuǎn)換器 RoHS:否 制造商:STMicroelectronics 最大輸入電壓:4.5 V 開關(guān)頻率:1.5 MHz 輸出電壓:4.6 V 輸出電流:250 mA 輸出端數(shù)量:2 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT |
| MAX1779EUE+ | 功能描述:直流/直流開關(guān)轉(zhuǎn)換器 Triple-Output TFT LCD RoHS:否 制造商:STMicroelectronics 最大輸入電壓:4.5 V 開關(guān)頻率:1.5 MHz 輸出電壓:4.6 V 輸出電流:250 mA 輸出端數(shù)量:2 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT |
| MAX1779EUE+T | 功能描述:直流/直流開關(guān)轉(zhuǎn)換器 Triple-Output TFT LCD RoHS:否 制造商:STMicroelectronics 最大輸入電壓:4.5 V 開關(guān)頻率:1.5 MHz 輸出電壓:4.6 V 輸出電流:250 mA 輸出端數(shù)量:2 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT |
| MAX1779EUE-T | 功能描述:直流/直流開關(guān)轉(zhuǎn)換器 RoHS:否 制造商:STMicroelectronics 最大輸入電壓:4.5 V 開關(guān)頻率:1.5 MHz 輸出電壓:4.6 V 輸出電流:250 mA 輸出端數(shù)量:2 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT |
| MAX177C/D | 功能描述:模數(shù)轉(zhuǎn)換器 - ADC RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 結(jié)構(gòu):Sigma-Delta 轉(zhuǎn)換速率:125 SPs to 8 KSPs 分辨率:24 bit 輸入類型:Differential 信噪比:107 dB 接口類型:SPI 工作電源電壓:1.7 V to 3.6 V, 2.7 V to 5.25 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:VQFN-32 |
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