M
SOT23 Local Temperature Comparators
with SMBus Serial Interface
2
_______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS (Note 1)
V
CC
to GND..............................................................-0.3V to +6V
ADD to GND...............................................-0.3V to (V
CC
+ 0.3V)
SMBCLK, SMBDATA,
ALERT
,
OVERT
to GND ........-0.3V to +6V
SMBDATA,
ALERT
,
OVERT
Current....................-1mA to +50mA
ELECTRICAL CHARACTERISTICS
(V
CC
= +3.3V,
T
A
= 0
°
C to +125
°
C
, unless otherwise noted. Typical values are at T
A
= +25
°
C.) (Note 2)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
Continuous Power Dissipation (T
A
= +70
°
C)
6-Pin SOT23 (derate 9.1mW/
°
C above +70
°
C)............727mW
Operating Temperature Range (extended).......-40
°
C to +125
°
C
Junction Temperature......................................................+150
°
C
Storage Temperature Range.............................-65
°
C to +150
°
C
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
TEMPERATURE COMPARATOR AND POWER SUPPLY
DAC Resolution (Note 3)
Monotonicity guaranteed
T
A
= +25
o
C to +100
o
C
T
A
= 0
o
C to +125
o
C
With respect to temperature comparison
value (MAX1755)
2
-3
-5
o
C
+3
+5
Temperature Comparison Error
o
C
Temperature Hysteresis
-4.5
-4
-3.5
Temperature Window
Lower threshold with respect to temperature
comparison value (MAX1756)
-9
-8
-7
o
C
Sampling Frequency
Supply Voltage Range
Undervoltage Lockout Threshold
Undervoltage Lockout Hysteresis
Power-On Reset Threshold
Operating Supply Current
Standby Supply Current
ADD Input High Voltage
ADD Input Low Voltage
SMBus INTERFACE
Logic Input High Voltage
Logic Input Low Voltage
SMBus Output Low Sink Current
ALERT
,
O V ERT
Output Low Sink Current
ALERT
,
O V ERT
Outp ut H gh Leakage C ur ent
Logi c Inp ut C urr ent ( ADD SM BC LK, SM BD ATA)
SMBus Input Capacitance
SMBus Clock Frequency
SMBCLK Clock Low Time
SMBCLK Clock High Time
0.50
2.375
2.05
1
2.00
5.5
2.35
kHz
V
V
mV
V
μA
μA
V
V
V
CC
input, rising edge
2.2
30
1.7
85
0.8
V
CC
, falling edge
S M Bus static, log c i nputs for ced to V
CC
or GN D
S M Bus static, log c i nputs for ced to V
CC
or GN D
0.2
2.3
200
4
0.8 x V
CC
0.2 x V
CC
SMBCLK, SMBDATA; V
CC
= 2.7V to 5.5V
SMBCLK, SMBDATA; V
CC
= 2.7V to 5.5V
S M BD ATA forced to 0.4V V
C C
= 2.7V to 5.5V
Pin forced to 0.4V
Pin forced to 5.5V
Inputs forced to V
CC
or GND
SMBCLK, SMBDATA
(Note 4)
t
LOW
, 10% to 10% p oi nts, V
CC
= 2.7V to 5.5V
t
H GH
, 90% to 90% p oi nts, V
C C
= 2.7V to 5.5V
SMBCLK, SMBDATA; 10% to 90% points,
V
CC
= 2.7V to 5.5V
2.1
V
V
0.8
6
6
mA
mA
μA
μA
pF
kHz
μs
μs
1
-1
+1
5
DC
4.7
4
100
SMBus Rise Time
1
μs
Note 1:
This device is constructed using a unique set of packaging techniques that impose a limit on the thermal profile to which the
device can be exposed during board-level solder attach and rework. The limit permits the use of only the solder profiles rec-
ommended in the industry-standard specification, JEDEC 020A, paragraph 7.6, Table 3 for IR/VPR and Convection reflow.
Preheating is required. Hand or wave soldering is not allowed.