參數(shù)資料
型號: MAX15501GTJ+T
廠商: Maxim Integrated Products
文件頁數(shù): 6/28頁
文件大小: 0K
描述: IC COND ANLG OUTPUT 2.5V 32TQFN
產(chǎn)品培訓模塊: Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
標準包裝: 2,500
類型: 調(diào)節(jié)器
數(shù)據(jù)接口: 串行,SPI?
電壓電源: 模擬和數(shù)字,雙 ±
電源電壓: ±24V,2.7 V ~ 5.25 V
工作溫度: -40°C ~ 105°C
安裝類型: 表面貼裝
封裝/外殼: 32-WFQFN 裸露焊盤
供應商設(shè)備封裝: 32-TQFN-EP(5x5)
包裝: 帶卷 (TR)
Industrial Analog Current/
Voltage-Output Conditioners
MAX15500/MAX15501
14 _____________________________________________________________________________________
Pin Description (continued)
PIN
NAME
FUNCTION
19
OUT
Analog Output. The analog voltage or current output range at OUT is programmable. See Tables
1 to 4 for possible output range settings.
20
AVDDO
Positive Output Driver Supply Voltage Input. AVDDO provides power to the driver output stage.
Bypass AVDDO to AVDD with a 0.1FF capacitor. Use diodes as shown in the Typical Operating
Circuit/Functional Diagram to ensure a voltage difference of 2V to 3.5V between AVDD and
AVDDO.
21
SENSERP
Sense Resistor Positive Connection. See the Typical Operating Circuit/Functional Diagram for the
typical connection.
22
SENSERN
Sense Resistor Negative Connection. See the Typical Operating Circuit/Functional Diagram for the
typical connection.
23
SENSEVN
Kelvin Sense Voltage Negative Input. See the Typical Operating Circuit/Functional Diagram for the
typical connection.
25
SENSEVP
Kelvin Sense Voltage Positive Input. See the Typical Operating Circuit/Functional Diagram for the
typical connection.
26
AVDD
Positive Analog Supply Voltage Input. Bypass AVDD to AGND with a 0.1FF capacitor.
28
AVSS
Negative Analog Supply Voltage Input. Bypass AVSS to AGND with a 0.1FF capacitor.
29
MON
Load Monitoring Output. MON provides an analog 0 to 3V output. See the Output Monitor section.
30
CS1
Active-Low SPI Chip-Select Input 1. See the SPI Interface section.
31
CS2
Active-Low SPI Chip-Select Input 2. See the SPI Interface section.
EP
Exposed Pad. Internally connected to AVSS. Connect to AVSS. Connect to a large copper area to
maximize thermal performance. Do not connect ground or signal lines through EP.
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