參數(shù)資料
型號： MAX1343BETX+T
廠商： Maxim Integrated Products
文件頁數(shù)： 12/44頁
文件大小： 0K
描述： IC ADC/DAC 12BIT W/FIFO 36WQFN
產(chǎn)品培訓(xùn)模塊： Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
標(biāo)準(zhǔn)包裝： 2,500
類型： ADC，DAC
分辨率（位）： 12 b
采樣率（每秒）： 225k
數(shù)據(jù)接口： MICROWIRE?，QSPI?，串行，SPI?
電壓電源： 模擬和數(shù)字
電源電壓： 2.7 V ~ 5.25 V
工作溫度： -40°C ~ 85°C
安裝類型： 表面貼裝
封裝/外殼： 36-WFQFN 裸露焊盤
供應(yīng)商設(shè)備封裝： 36-TQFN 裸露焊盤（6x6）
包裝： 帶卷 (TR)
MAX1221/MAX1223/MAX1343
12-Bit, Multichannel ADCs/DACs with FIFO,
Temperature Sensing, and GPIO Ports
2
_______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
(AVDD = DVDD = 2.7V to 5.25V, external reference VREF = 2.5V, fCLK = 3.6MHz (50% duty cycle), TA = -40°C to +85°C, unless other-
wise noted. Typical values are at AVDD = DVDD = 3V. TA = +25°C. Outputs are unloaded, unless otherwise noted.)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
AVDD to AGND .........................................................-0.3V to +6V
DGND to AGND.....................................................-0.3V to +0.3V
DVDD to AVDD .......................................................-3.0V to +0.3V
Digital Inputs to DGND.............................................-0.3V to +6V
Digital Outputs to DGND .........................-0.3V to (DVDD + 0.3V)
Analog Inputs, Analog Outputs and REF_
to AGND ...............................................-0.3V to (AVDD + 0.3V)
Maximum Current into Any Pin (except AGND, DGND, AVDD,
DVDD, and OUT_) ...........................................................50mA
Maximum Current into OUT_.............................................100mA
Continuous Power Dissipation (TA = +70°C)
36-Pin Thin QFN (6mm x 6mm)
(derate 26.3mW/°C above +70°C) ......................2105.3mW
Operating Temperature Range ...........................-40°C to +85°C
Storage Temperature Range .............................-60°C to +150°C
Junction Temperature ......................................................+150°C
Lead Temperature (soldering, 10s) .................................+300°C
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
ADC
DC ACCURACY (Note 1)
Resolution
12
Bits
Integral Nonlinearity
INL
±0.5
±1.0
LSB
Differential Nonlinearity
DNL
±0.5
±1.0
LSB
Offset Error
±0.5
±4.0
LSB
Gain Error
(Note 2)
±0.5
±4.0
LSB
Gain Temperature Coefficient
±0.8
ppm/°C
Channel-to-Channel Offset
±0.1
LSB
DYNAMIC SPECIFICATIONS (10kHz sine-wave input, VIN = 2.5VP-P, 225ksps, fCLK = 3.6MHz)
Signal-to-Noise Plus Distortion
SINAD
70
dB
Total Harmonic Distortion
(Up to the Fifth Harmonic)
THD
-76
dBc
Spurious-Free Dynamic Range
SFDR
72
dBc
Intermodulation Distortion
IMD
fIN1 = 9.9kHz, fIN2 = 10.2kHz
76
dBc
Full-Linear Bandwidth
SINAD > 70dB
100
kHz
Full-Power Bandwidth
-3dB point
1
MHz
CONVERSION RATE (Note 3)
External reference
0.8
s
Power-Up Time
tPU
Internal reference (Note 4)
218
Conversion
clock
cycles
Note: If the package power dissipation is not exceeded, one output at a time may be shorted to AVDD, DVDD, AGND, or DGND
indefinitely.
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