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    參數(shù)資料
    型號(hào): MAX1174BEUP+T
    廠商: Maxim Integrated Products
    文件頁(yè)數(shù): 2/15頁(yè)
    文件大?。?/td> 0K
    描述: IC ADC 14BIT 135KSPS 20-TSSOP
    標(biāo)準(zhǔn)包裝: 2,500
    位數(shù): 14
    采樣率(每秒): 135k
    數(shù)據(jù)接口: 并聯(lián)
    轉(zhuǎn)換器數(shù)目: 1
    功率耗散(最大): 879mW
    電壓電源: 模擬和數(shù)字
    工作溫度: -40°C ~ 85°C
    安裝類型: 表面貼裝
    封裝/外殼: 20-TSSOP(0.173",4.40mm 寬)
    供應(yīng)商設(shè)備封裝: 20-TSSOP
    包裝: 帶卷 (TR)
    輸入數(shù)目和類型: 1 個(gè)單端,雙極
    MAX1156/MAX1158/MAX1174
    External Reference
    An external reference can be placed at either the input
    (REFADJ) or the output (REF) of the MAX1156/
    MAX1158/MAX1174’s internal buffer amplifier. Using
    the buffered REFADJ input makes buffering the exter-
    nal reference unnecessary. The input impedance of
    REFADJ is typically 5k
    . The internal buffer output
    must be bypassed at REF with a 10F capacitor.
    Connect REFADJ to AVDD to disable the internal buffer.
    Directly drive REF using an external 3.8V to 4.2V refer-
    ence. During conversion, the external reference must
    be able to drive 100A of DC load current and have an
    output impedance of 10
    or less.
    For optimal performance, buffer the reference through
    an op amp and bypass REF with a 10F capacitor.
    Consider the MAX1156/MAX1158/MAX1174’s equiva-
    lent input noise (0.32LSB) when choosing a reference.
    Reading the Conversion Result
    EOC is provided to flag the microprocessor when a
    conversion is complete. The falling edge of EOC sig-
    nals that the data is valid and ready to be output to the
    bus. D0–D13 are the parallel outputs of the
    MAX1156/MAX1158/MAX1174. These three-state out-
    puts allow for direct connection to a microcontroller I/O
    bus. The outputs remain high-impedance during acqui-
    sition and conversion. Data is loaded onto the output
    bus with the third falling edge of CS with R/C high (after
    tDO). Bringing CS high forces the output bus back to
    high impedance. The MAX1156/MAX1158/MAX1174
    then wait for the next falling edge of CS to start the next
    conversion cycle (see Figure 2).
    HBEN toggles the output between the high/low byte.
    The low byte is loaded onto the output bus when HBEN
    is low and the high byte is on the bus when HBEN is
    high. The two MSBs of the high byte are always zero.
    Transfer Function
    Figures 8, 9, and 10 show the MAX1156/MAX1158/
    MAX1174 output transfer functions. The MAX1158 and
    MAX1174 outputs are coded in offset binary, while the
    MAX1156 is coded in standard binary.
    Input Buffer
    Most applications require an input buffer amplifier to
    achieve 14-bit accuracy and prevent loading the
    source. Switch the channels immediately after acquisi-
    tion, rather than near the end of or after a conversion,
    when the input signal is multiplexed. This allows more
    time for the input buffer amplifier to respond to a large
    step-change in input signal. The input amplifier must
    have a high enough slew rate to complete the required
    output voltage change before the beginning of the
    acquisition time. Figure 11 shows an example of this
    circuit using the MAX427.
    Figures 12a and 12b show how the MAX1158 and
    MAX1174 analog input current varies depending on
    whether the chip is operating or powered down. The
    part is fully powered down between conversions if the
    voltage at R/C is set high during the second falling
    edge of CS. The input current abruptly steps to the
    powered up value at the start of acquisition. This step
    in the input current can disrupt the ADC input, depend-
    ing on the driving circuit’s output impedance at high
    frequencies. If the driving circuit cannot fully settle by
    14-Bit, 135ksps, Single-Supply ADCs with
    Bipolar Analog Input Range
    10
    ______________________________________________________________________________________
    CS
    R/C
    EOC
    REF AND
    BUFFER
    POWER
    ACQUISITION
    CONVERSION
    DATA
    OUT
    Figure 5. Selecting Standby Mode
    CS
    R/C
    EOC
    REF AND
    BUFFER
    POWER
    ACQUISITION
    CONVERSION
    DATA
    OUT
    Figure 6. Selecting Shutdown Mode
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    參數(shù)描述
    MAX1175ACUI 功能描述:模數(shù)轉(zhuǎn)換器 - ADC RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 結(jié)構(gòu):Sigma-Delta 轉(zhuǎn)換速率:125 SPs to 8 KSPs 分辨率:24 bit 輸入類型:Differential 信噪比:107 dB 接口類型:SPI 工作電源電壓:1.7 V to 3.6 V, 2.7 V to 5.25 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:VQFN-32
    MAX1175ACUI+ 功能描述:模數(shù)轉(zhuǎn)換器 - ADC RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 結(jié)構(gòu):Sigma-Delta 轉(zhuǎn)換速率:125 SPs to 8 KSPs 分辨率:24 bit 輸入類型:Differential 信噪比:107 dB 接口類型:SPI 工作電源電壓:1.7 V to 3.6 V, 2.7 V to 5.25 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:VQFN-32
    MAX1175ACUI+T 功能描述:模數(shù)轉(zhuǎn)換器 - ADC RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 結(jié)構(gòu):Sigma-Delta 轉(zhuǎn)換速率:125 SPs to 8 KSPs 分辨率:24 bit 輸入類型:Differential 信噪比:107 dB 接口類型:SPI 工作電源電壓:1.7 V to 3.6 V, 2.7 V to 5.25 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:VQFN-32
    MAX1175ACUI-T 功能描述:模數(shù)轉(zhuǎn)換器 - ADC RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 結(jié)構(gòu):Sigma-Delta 轉(zhuǎn)換速率:125 SPs to 8 KSPs 分辨率:24 bit 輸入類型:Differential 信噪比:107 dB 接口類型:SPI 工作電源電壓:1.7 V to 3.6 V, 2.7 V to 5.25 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:VQFN-32
    MAX1175AEUI 功能描述:模數(shù)轉(zhuǎn)換器 - ADC RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 結(jié)構(gòu):Sigma-Delta 轉(zhuǎn)換速率:125 SPs to 8 KSPs 分辨率:24 bit 輸入類型:Differential 信噪比:107 dB 接口類型:SPI 工作電源電壓:1.7 V to 3.6 V, 2.7 V to 5.25 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:VQFN-32