參數(shù)資料
型號: MAAPGM0036-DIE
英文描述: 1.2-3.2 GHz 1.2W Power Amplifier
中文描述: 1月2日至3月二號頻率為1.2W功率放大器
文件頁數(shù): 6/6頁
文件大小: 260K
代理商: MAAPGM0036-DIE
1.2-3.2 GHz 1.2W Power Amplifier
MAAPGM0036-DIE
RO-P-DS-3017 B
Preliminary Information
M/A-COM Inc. and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice. M/A-COM makes
no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose, nor does M/A-COM assume any liability
whatsoever arising out of the use or application of any product(s) or
information.
North America
Tel: 800.366.2266 / Fax: 978.366.2266
Europe
Tel: 44.1908.574.200 / Fax: 44.1908.574.300
Asia/Pacific
Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macom.com
for additional data sheets and product information.
6
Figure 6. Recommended bonding diagram
for pedestal mount.
Support circuitry typical of MMIC characterization fixture for CW test-
Assembly Instructions:
Die attach:
Use AuSn (80/20) 1-2 mil. preform solder. Limit time @ 300 °C to less than 5 minutes.
Wirebonding:
Bond @ 160 °C using standard ball or thermal compression wedge bond techniques.
For DC pad connections, use either ball or wedge bonds. For best RF performance, use wedge
bonds of shortest length, although ball bonds are also acceptable.
Biasing Note: Must apply negative bias to V
GG
before applying positive bias to V
DD
to prevent
damage to amplifier.
I
V
G
V
G
V
D
V
D
O
100 pF
100 pF
100 pF
RF
IN
RF
OUT
0.1
μ
F
V
GG
0.1
μ
F
V
DD
100 pF
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