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參數(shù)資料
| 型號： | MA4M3020 |
| 英文描述： | MNS Microwave Chip Capacitors |
| 中文描述： | 硫化錳微波貼片電容 |
| 文件頁數(shù)： | 4/4頁 |
| 文件大?。?/td> | 40K |
| 代理商： | MA4M3020 |
M/A-COM Division of AMP Incorporated
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North America: Tel. (800) 366-2266, Fax (800) 618-8883
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Asia/Pacific: Tel.+85 2 2111 8088, Fax +85 2 2111 8087
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Europe: Tel. +44 (1344) 869 595, Fax+44 (1344) 300 020
www.macom.com
AMP and Connecting at a Higher Level are trademarks.
Specifications subject to change without notice.
MNS Microwave Chip Capacitors
MA4M Series
V3.00
Bonding and Handling Considerations for
MNS Chip Capacitors
Handling
Normal precautions that are common to the handling of hybrid
semiconductors also apply to MNS chip capacitors. Removal of
chips from waffle packs and subsequent handling should be
done with a vacuum pencil. Pencils equipped with either metal-
lic or nonmetallic tips are acceptable.
Surface Preparation
Each MNS chip and substrate should be free of oils and other
surface contamination. Such contaminants may result in poor
solder wetting. Cleansing can be done with acetone, alcohol,
freon, TMS or other common microelectronic solvents. Bur-
nishing of MNS capacitor chips is not necessary or recom-
mended.
Solder
Soldering temperatures up to 300oC are acceptable for a duration
not greater than 5 seconds for MNS chip capacitors. Any of the
common tin-lead-silver, lead-indium, or higher temperature gold
alloy solders are acceptable provided that the 300oC temperature
is not exceeded. Pure tin or tin-antimony solders are not
recommended. Cleaning of residual flux is required and can be
accomplished with a fluorinated or chlorinated solvent.
Conductive Epoxy
Any of the conductive epoxies that are available for semicon-
ductor die attachment are acceptable for MNS chip capacitor
attachment. Follow the manufacturer’s recommendations for
mixing and application carefully. Take care to seat the capacitor
on the substrate using a soft implement.
Lead Bonding
Ball, ultrasonic, TC or pulse bonding of the wire or ribbon leads
are all acceptable methods. Temperature for the pulse bonder
should not exceed 300oC. Maximum pressure applied to the
MNS capacitor chips should not exceed 25 grams for any of the
methods used. Proper procedure will result in bond strength that
exceeds MIL-STD-883B Method 2011.2 for gold wire or gold
ribbon.
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| MA4M3030 | MNS Microwave Chip Capacitors |
| MA4M3050 | MNS Microwave Chip Capacitors |
| MA4M3100 | MNS Microwave Chip Capacitors |
| MA4M3150 | MNS Microwave Chip Capacitors |
| MA4BPS201 | PIN Diode Chips with Offset Bond Pads |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MA4M3030 | 制造商:M/A-COM Technology Solutions 功能描述:MNS (METAL-NITRIDE-SILICON) MIRCOWAVE CHIP CAPACITOR - Gel-pak, waffle pack, wafer, diced wafer on film 制造商:M/A-COM Technology Solutions 功能描述:SILICON CAPACITOR (MIS/MNS) |
| MA4M3030-352 | 制造商:M/A-COM Technology Solutions 功能描述:MNS CHIP CAPACITOR - Gel-pak, waffle pack, wafer, diced wafer on film |
| MA4M3050 | 功能描述:硅電容器 50pF Max Stdoff V200 -55C +200C RoHS:否 制造商:IPDiA 電容:1 uF 容差:15 % 電壓額定值:5 V 溫度系數(shù):0.5 % 工作溫度范圍:- 55 C to + 150 C 封裝 / 箱體:1206 外殼高度:0.4 mm 系列:HSSC427.xxx 類型:1206 High Stability Silicon Capacitor |
| MA4M3050-354 | 制造商:M/A-COM Technology Solutions 功能描述:MNS CHIP CAPACITOR *OBSOLETE* - Gel-pak, waffle pack, wafer, diced wafer on film 制造商:M/A-COM Technology Solutions 功能描述:SILICON CAPACITOR (MIS/MNS) |
| MA4M3080-357 | 制造商:M/A-COM Technology Solutions 功能描述:MNS CHIP CAPACITOR - Gel-pak, waffle pack, wafer, diced wafer on film |
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