參數(shù)資料
型號(hào)： M7020R-083ZA1T
廠商： 意法半導(dǎo)體
英文描述： 32K x 68-bit Entry NETWORK SEARCH ENGINE
中文描述： 32K的× 68位進(jìn)入網(wǎng)絡(luò)搜索引擎
文件頁數(shù)： 148/150頁
文件大?。?/td> 996K
代理商： M7020R-083ZA1T
M7020R
148/150
PACKAGE MECHANICAL INFORMATION
Figure 107. PBGA-Z00 – 272-ball Plastic Ball Grid Array Package Outline
Note: Drawing is not to scale.
Table 54. PBGA-Z00 – 272-ball Plastic Ball Grid Array Package Mechanical Data
mm
Note: 1. Maximum mounted height is 2.45mm based on a 0.65mm ball pad diameter. Solder paste is 0.15mm thickness and 0.65mm in di-
ameter.
2. The terminal A1 corner must be identified on the top surface by using a corner chamfer, ink, or metallized markings, or other feature
of package body or integral heatslug.
3. A distinguished feature is allowable on the bottom surface of the package to identify the terminal A1 corner.
4. Exact shape of each corner is optional.
Symb
inches
Typ
Min
Max
Typ
Min
Max
A
(4)
27.00
26.80
27.20
(1)
1.102
1.094
1.110
(1)
A1
(2,3)
0.60
0.50
0.70
0.024
0.020
0.029
A2
1.63
1.90
0.067
0.078
B
(4)
27.00
26.80
27.20
1.102
1.094
1.110
b
0.75
0.60
0.90
0.031
0.024
0.037
D
27.00
26.80
27.20
1.102
1.094
1.110
D1
24.13
0.985
D2
24.00
0.980
e
1.27
0.052
E
27.00
26.80
27.20
1.102
1.094
1.110
E1
24.13
0.985
E2
24.00
0.980
n
272
272
ddd
0.20
0.008
eee
0.30
0.012
A2
A1
1.17 REF.
0.56 REF.
E2
PIN #1
D2
ddd C
0.220 (3x)
C
B
A
e
e
E
E1
b
D1
D
2019181716151413121110987654321
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
0.300 C
0.100 C
S
A
b (272x)
B
S
PBGA-Z00
4.00*45 (4x)
30 TYP.
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