5-4 Revision 13 Revision Changes Page Revision 9 (Aug 2009) Product Brief v1.2 All references to speed grade –F have been re" />
參數(shù)資料
型號(hào): M1A3PE3000-2FGG896
廠商: Microsemi SoC
文件頁數(shù): 62/162頁
文件大?。?/td> 0K
描述: IC FPGA 1KB FLASH 3M 896-FBGA
標(biāo)準(zhǔn)包裝: 27
系列: ProASIC3E
RAM 位總計(jì): 516096
輸入/輸出數(shù): 620
門數(shù): 3000000
電源電壓: 1.425 V ~ 1.575 V
安裝類型: 表面貼裝
工作溫度: 0°C ~ 70°C
封裝/外殼: 896-BGA
供應(yīng)商設(shè)備封裝: 896-FBGA(31x31)
Datasheet Information
5-4
Revision 13
Revision
Changes
Page
Revision 9 (Aug 2009)
Product Brief v1.2
All references to speed grade –F have been removed from this document.
N/A
definitions of hot-swap and cold-sparing.
DC
and
Switching
Characteristics v1.3
3.3 V LVCMOS and 1.2 V LVCMOS Wide Range support was added to the
datasheet. This affects all tables that contained 3.3 V LVCMOS and 1.2 V
LVCMOS data.
N/A
IIL and IIH input leakage current information was added to all "Minimum and
Maximum DC Input and Output Levels" tables.
N/A
–F was removed from the datasheet. The speed grade is no longer supported.
N/A
voltage" and note 4 are new.
table was updated.
There are new parameters and data was updated in the Table 2-99 RAM4K9
table.
There are new parameters and data was updated in the Table 2-100
Revision 8 (Feb 2008)
Product Brief v1.1
Revision 7 (Jun 2008)
DC
and
Switching
Characteristics v1.2
remove "as measured on quiet I/Os." Table note 2 was revised to remove
"estimated SSO density over cycles." Table note 3 was deleted
.
updated.
Revision 6 (Jun 2008) The A3PE600 "FG484" table was missing G22. The pin and its function were
added to the table.
Revision 5 (Jun 2008)
Packaging v1.4
The naming conventions changed for the following pins in the "FG484" for the
A3PE600:
Pin Number
New Function Name
J19
IO45PPB2V1
K20
IO45NPB2V1
M2
IO114NPB6V1
N1
IO114PPB6V1
N4
GFC2/IO115PPB6V1
P3
IO115NPB6V1
Revision 4 (Apr 2008)
Product Brief v1.0
The product brief portion of the datasheet was divided into two sections and given
a version number, starting at v1.0. The first section of the document includes
features, benefits, ordering information, and temperature and speed grade
offerings. The second section is a device family overview.
N/A
Packaging v1.3
The "FG324" package diagram was replaced.
相關(guān)PDF資料
PDF描述
AYM43DRSN CONN EDGECARD 86POS DIP .156 SLD
AGM43DRSN CONN EDGECARD 86POS DIP .156 SLD
AYM43DRSH CONN EDGECARD 86POS DIP .156 SLD
ASM43DRSH CONN EDGECARD 86POS DIP .156 SLD
EP2AGX45CU17C5N IC ARRIA II GX FPGA 45K 358UBGA
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
M1A3PE3000-2FGG896ES 制造商:ACTEL 制造商全稱:Actel Corporation 功能描述:ProASIC3E Flash Family FPGAs
M1A3PE3000-2FGG896I 功能描述:IC FPGA 1KB FLASH 3M 896-FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場(chǎng)可編程門陣列) 系列:ProASIC3E 標(biāo)準(zhǔn)包裝:1 系列:ProASICPLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計(jì):129024 輸入/輸出數(shù):248 門數(shù):600000 電源電壓:2.3 V ~ 2.7 V 安裝類型:表面貼裝 工作溫度:- 封裝/外殼:352-BFCQFP,帶拉桿 供應(yīng)商設(shè)備封裝:352-CQFP(75x75)
M1A3PE3000-2FGG896PP 制造商:ACTEL 制造商全稱:Actel Corporation 功能描述:ProASIC3E Flash Family FPGAs
M1A3PE3000-2PQ208 功能描述:IC FPGA 1KB FLASH 3M 208-PQFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場(chǎng)可編程門陣列) 系列:ProASIC3E 產(chǎn)品培訓(xùn)模塊:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 特色產(chǎn)品:Cyclone? IV FPGAs 標(biāo)準(zhǔn)包裝:60 系列:CYCLONE® IV GX LAB/CLB數(shù):9360 邏輯元件/單元數(shù):149760 RAM 位總計(jì):6635520 輸入/輸出數(shù):270 門數(shù):- 電源電壓:1.16 V ~ 1.24 V 安裝類型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:484-BGA 供應(yīng)商設(shè)備封裝:484-FBGA(23x23)
M1A3PE3000-2PQ208I 功能描述:IC FPGA 1KB FLASH 3M 208-PQFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場(chǎng)可編程門陣列) 系列:ProASIC3E 標(biāo)準(zhǔn)包裝:1 系列:ProASICPLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計(jì):129024 輸入/輸出數(shù):248 門數(shù):600000 電源電壓:2.3 V ~ 2.7 V 安裝類型:表面貼裝 工作溫度:- 封裝/外殼:352-BFCQFP,帶拉桿 供應(yīng)商設(shè)備封裝:352-CQFP(75x75)