參數(shù)資料
型號: M14C04DD
廠商: 意法半導體
英文描述: M14C04 Die Description
中文描述: M14C04模具描述
文件頁數(shù): 6/13頁
文件大小: 108K
代理商: M14C04DD
M14C16, M14C04
6/13
Figure 6. Write Mode Sequences with WC=0
S
S
BYTE WRITE
DEV SEL
BYTE ADDR
DATA IN
WC
S
PAGE WRITE
DEV SEL
BYTE ADDR
DATA IN 1
DATA IN 2
WC
DATA IN 3
AI02804
PAGE WRITE
(cont'd)
WC (cont'd)
S
DATA IN N
ACK
R/W
ACK
ACK
ACK
ACK
ACK
ACK
R/W
ACK
ACK
Table 4. Operating Modes
Note: 1. X =
V
IH
or V
IL
.
Mode
RW bit
WC
1
Bytes
Initial Sequence
Current Address Read
‘1’
X
1
START, Device Select, RW = ‘1’
Random Address Read
‘0’
X
1
START, Device Select, RW = ‘0’, Address
‘1’
X
reSTART, Device Select, RW = ‘1’
Sequential Read
‘1’
X
1
Similar to Current or Random Mode
Byte Write
‘0’
V
IL
1
START, Device Select, RW = ‘0’
Page Write
‘0’
V
IL
16
START, Device Select, RW = ‘0’
typical time is shorter. To make use of this, an ACK
polling sequence can be used by the master.
The sequence, as shown in Figure 7, is as follows:
– Initial condition: a Write is in progress.
– Step 1: the master issues a START condition
followed by a device select byte (first byte of the
new instruction).
– Step 2: if the memory is busy with the internal
write cycle, no ACK will be returned and the
master goes back to Step 1. If the memory has
terminated the internal write cycle, it responds
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