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參數(shù)資料
| 型號： | LX1701ILQTR |
| 廠商： | MICROSEMI CORP-ANALOG MIXED SIGNAL GROUP |
| 元件分類： | 音頻／視頻放大 |
| 英文描述： | 3.9 W, 1 CHANNEL, AUDIO AMPLIFIER, PQCC16 |
| 封裝： | 4 X 4 MM, PLASTIC, MLPQ-16 |
| 文件頁數(shù)： | 8/20頁 |
| 文件大?。?/td> | 478K |
| 代理商： | LX1701ILQTR |
LX1701
PRODUCTION DATA SHEET
Microsemi
Integrated Products Division
11861 Western Avenue, Garden Grove CA. 92841 714-898-8121, FAX 714-893-2570
Page 16
WWW
.Microse
m
i
.CO
M
2W Filterless Mono Class-D Audio Amplifier
Copyright
2004
Rev. 1.0, 2004-06-09
TM
PCB DESIGN GUID ELINES
PCB DESIGN GUIDELINES
One of the key efforts in implementing the MLP package
on a pc board is the design of the land pattern. The MLP
has rectangular metallized terminals exposed on the bottom
surface of the package body. Electrical and mechanical
connection between the component and the pc board is
made by screen printing solder paste on the pc board and
reflowing the paste after placement. To guarantee reliable
solder joints it is essential to design the land pattern to the
MLP terminal pattern, exposed PAD and Thermal PAD via.
There are two basic designs for PCB land pads for the
MLP: Copper Defined style (also known as Non Solder
Mask Defined (NSMD)) and the Solder Mask Defined style
(SMD). The industry has had some debate of the merits of
both styles of land pads, and although we recommend the
Copper Defined style land pad (NSMD), both styles are
acceptable for use with the MLP package. NSMD pads are
recommended over SMD pads due to the tighter tolerance
on copper etching than solder masking. NSDM by
definition also provides a larger copper pad area and allows
the solder to anchor to the edges of the copper pads thus
providing improved solder joint reliability.
DESIGN
OF
PCB
LAND
PATTERN
FOR
PACKAGE
TERMINALS
As a general rule, the PCB lead finger pad (Y) should be
designed 0.2-0.5mm longer than the package terminal
length for good filleting. The pad length should extended
0.05mm towards the centerline of the package. The pad
width (X) should be a minimum 0.05mm wider than the
package terminal width (0.025mm per side), refer to figure
5. However, the pad width is reduced to the width of the
component terminal for lead pitches below 0.65mm. This is
done to minimize the risk of solder bridging.
0.05mm
Y2
0.20mm
Y1
PCB
PCB Pad
Solder
Part Lead
Part
Figure 5 –
PC Board Land Pattern Geometry for MLP Terminals
EXPOSED PAD PCB DESIGN
The construction of the Exposed Pad MLP enables
enhanced thermal and electrical characteristics. In order to
take full advantage of this feature the exposed pad must be
physically connected to the PCB substrate with solder.
The thermal pad (D2th) should be greater than D2 of the
MLP whenever possible, however adequate clearance (Cpl
> 0.15mm) must be met to prevent solder bridging. If this
clearance cannot be met, then D2th should be reduced in
area. The formula would be: D2TH >D2 only if D2TH <
Gmin - (2 x Cpl).
D2th
2.5mm Max
Gmin
2.9mm
Zmin
4.55mm
Figure 6 –
Land Pattern for LQ16 (4x4mm)
Zmin= D + aaa + 2(0.2)
(where pkg body tolerance aaa=0.15)
(where 0.2 is outer pad extension)
Gmin= D-2(Lmax)-2(0.05)
(where 0.05 is inner pad extension)
(Lmax=0.50 for this example)
D2th max = Gmin-2(CpL)
(where CpL=0.2)
AA
PP
LL
IICC
AA
TT
IIOO
NN
SS
(X1) Min: 0.025mm
Per side for lead
pitches > 0.65mm
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| LX1701ILQ | 3.9 W, 1 CHANNEL, AUDIO AMPLIFIER, PQCC16 |
| LX1702CLQ-TR | 1.6 W, 2 CHANNEL, AUDIO AMPLIFIER, PQCC16 |
| LX1704CLQ-TR | 3.3 W, 2 CHANNEL, AUDIO AMPLIFIER, PQCC16 |
| LX1704ILQ-TR | 3.3 W, 2 CHANNEL, AUDIO AMPLIFIER, PQCC16 |
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相關(guān)代理商/技術(shù)參數(shù) |
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| LX1701SPK EVAL KIT | 制造商:Microsemi Corporation 功能描述:AUDIOMAX PRODUCTS - Bulk |
| LX1702 | 制造商:MICROSEMI 制造商全稱:Microsemi Corporation 功能描述:1W Filter less Stereo Class-D Amplifier |
| LX1702 EVAL KIT | 制造商:Microsemi Corporation 功能描述:AUDIOMAX PRODUCTS - Bulk |
| LX1702CLQ | 制造商:Microsemi Corporation 功能描述:AUDIOMAX PRODUCTS - Bulk |
| LX1704 | 制造商:MICROSEMI 制造商全稱:Microsemi Corporation 功能描述:2W Filter less Stereo Class-D Amplifier |
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