參數(shù)資料
型號: LTS350Q1-PD1
廠商: SAMSUNG SEMICONDUCTOR CO. LTD.
英文描述: Product Information
中文描述: 產(chǎn)品信息
文件頁數(shù): 44/58頁
文件大?。?/td> 1171K
代理商: LTS350Q1-PD1
Standard No. (R3)
151-E MU-601A2SA00
9-5
J udgment
A: Ignored
B: 2
or less
C: 1
or less
D: Zero
Classification Product specification for information
Item
Specification
12-2 Dot-like foreign
matter
A:d
B:0.1
C: 0.2
D:d
=(Long dia. + short dia.)/2
A:d
0.1
B:0.1
d
0.2
C: 0.2
d
0.3
D:d
0.3 d(mm):
A:L
.0 and W
0.0
B: 2.0
L or 0.02
W
L(mm) : overall length, W(mm): width
A:L
2.0
W
0.02
B:2.0
0.02
L(mm):
W(mm):
(1)Chip reaching bottom glass pattern Y
0.1
d
d
0.2
0.3
0.3 d(mm): average diameter
=(
)/2
A:
B:2
C:1
D:0
A: Ignored
B: Zero
12-3 Linear foreign
matter
W
A:
B:0
12-4 Chip and crack
1mm
1mm
Y
(2)General chip
X: width direction to ridge line. Y: length direction to ridge line.
Z: thickness direction to ridge line. t: bottom glass thickness.
X
Y
Z
t
X(mm)
3.0
Y(mm)
3.0
Z
2/3t
(3)Corner chip
t: bottom glass thickness
X(mm)
3.0
Y(mm)
3.0
Z
2/3t
t
Remarks/Revision
Approval
Check
Check
Signature
Date issued
Oct,26,2001
Date enforced
Oct,26,2001
Electromechanical
Components Business Unit
T.Yagasaki
T.Yagasaki
H,Komiya
K,Okamoto
Custom Components Company Matsushita Electronic Components Co., Ltd
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