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LTC6801
16
6801fb
Table 6. Failure Mechanism Effect Analysis (FMEA)
SCENARIO
EFFECT
DESIGN MITIGATION
Cell input open-circuit (random)
Power-up sequence at IC inputs
Clamp diodes at each pin to V+ & V– (within IC)
provide alternate PowerPath.
Cell input open-circuit (random)
Differential input voltage overstress
Zener diodes across each cell voltage input pair
(within IC) limit stress.
Top cell input connection loss (V+)
Power will come from highest connected cell
input
Clamp diodes at each pin to V+ and V– (within
IC) provide alternate PowerPath. Error condition
will be indicated by all upstream and downstream
units (no clock on SOUT/ SOUT).
Bottom cell input connection loss (V–)
Power will come from lowest connected cell input Clamp diodes at each pin to V+ and V– (within
IC) provide alternate PowerPath. Error condition
will be indicated by all upstream and downstream
units (no clock on SOUT/ SOUT).
Power input disconnection
(amongst stacked units)
Loss of supply connections
Clamp diodes at each pin to V+ and V– (within
IC) provide alternate PowerPath. Error condition
will be indicated by all upstream and downstream
units (no clock on SOUT/ SOUT).
Status link disconnection
(between stacked units)
Break of “daisy chain” communication
(no stress to ICs)
Daisy chain will be broken and error condition
will be indicated by all upstream and downstream
units (no clock on SOUT/ SOUT).
Short between any two conguration inputs
Power supplies connected to pins will be shorted
If VREF or VREG is shorted to V–, supply will
be removed from internal circuitry and error
condition will be indicated by all upstream and
downstream units (no clock on SOUT/ SOUT). If
VREF is shorted to VREG, a self test error will be
agged.
Open connection on conguration input
Control input will be pulled towards positive or
negative potential depending on pin
Control input will be pulled to a more stringent
condition (larger number of channels, higher UV
threshold, lower OV threshold, shorter duty cycle,
etc. ensuring either more stringent monitoring or
error condition will be indicated by all upstream
and downstream units (no clock on SOUT/
SOUT).
Cell-pack integrity, break between stacked units
Daisy-chain voltage reversal up to full stack
potential
Full stack potential may appear across status/
enable isolation devices, but will not be seen by
the IC. isolation capacitors should therefore be
rated to withstand the full stack potential.
Cell-pack integrity, break within stacked unit
Cell input reverse overstress
Add battery tap fuses and Schottky diodes in
parallel with the cell inputs to limit stress on
IC. Diode and connections must handle current
sufcient to open fuse
APPLICATIONS INFORMATION